#United States #San Jose #DoD #NextFlex #hybrid electronics

NextFlex's Transformative Funding Opportunity for Hybrid Electronics

On March 20, 2025, NextFlex, the Department of Defense (DoD)-backed manufacturing innovation institute specializing in hybrid electronics, revealed an exciting funding initiative known as Project Call 10.0 (PC 10.0). This project aims to allocate up to $5 million to enhance the U.S. electronics industrial base and expand the usage of hybrid electronics across various industries, including aerospace, automotive, and healthcare.

Aiming for Innovation and Growth

The primary objective of PC 10.0 is to address significant challenges in transitioning hybrid electronics into both defense and commercial markets. This ambitious project is expected to foster innovation while concurrently enhancing the manufacturing capabilities of hybrid electronics, an area critical to the nation’s technological advancement.

Dr. Scott Miller, the director of technology at NextFlex, highlighted the collaborative effort between the institute, its members, and the DoD in paving the way for advancements in hybrid electronics manufacturing. He stated, "With PC 10, we continue to address the priorities of the U.S. manufacturing industry as it strives to meet commercial and defense demands."

Project Goals and Areas of Focus

PC 10.0 proposes a diverse range of topics to allow participation from a broad spectrum of proposers. The project seeks to cover various advanced manufacturing challenges associated with hybrid electronics. Some areas of focus include:

• - Maturing and Derisking Hybrid Electronics Manufacturing Processes: Enhancing the reliability and efficiency of production processes.
• - AI/ML Applications: Leveraging artificial intelligence and machine learning to streamline design, manufacturing, and qualification of hybrid electronics.
• - Additive Manufacturing in Defense: Innovations in additive manufacturing for electronics within the defense sector to enhance operational capacities.
• - Cost Reduction and Readiness: Developing platforms that promise reduced life cycle costs while improving the readiness of DoD systems.
• - Open Topic Proposals: Accommodating new project ideas not covered in the specified topics, fostering creativity and innovation.

Roadmaps for Future Development

In conjunction with announcing the funding opportunity, NextFlex unveiled its latest public roadmaps outlining hybrid electronics technology. These roadmaps, developed by experts from various sectors, provide essential insights into market opportunities, current technological standings, stakeholder roles, and a development roadmap extending five years ahead. Members of NextFlex have exclusive access to in-depth versions that reveal prioritized technical gaps in the industry.

Contributions and Future Proposals

As hybrid electronics play a vital role in modern technology by integrating silicon Integrated Circuits (ICs) into everyday products through innovative and cost-effective additive processes, NextFlex is at the forefront of promoting sustainable manufacturing ecosystems. The consortium, which includes companies, academic institutions, and government bodies, collectively works toward bridging the manufacturing workforce gap and driving innovation.

Proposals for PC 10.0 are expected by May 21, with a Proposer's Day and Teaming webinar scheduled for March 27 to assist interested proposers. For further details about submission guidelines and participation, visit NextFlex's website.

The establishment of a significant funding opportunity such as this echoes the growing recognition of hybrid electronics' imperative role in enhancing U.S. technology manufacturing. As the industry stands on the cusp of transformation, initiatives like PC 10.0 are set to propel hybrid electronics into a new era, ensuring that they meet both civilian and military needs effectively.