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ZutaCore's Innovative Cooling Solution: OmniTherm

In the realm of data centers, continuous innovation is crucial to meet the growing demands brought on by AI and high-performance computing (HPC). Recently, ZutaCore showcased a significant leap in cooling technology with its new product, the ZutaCore OmniTherm. This cutting-edge solution was officially introduced at the 2025 OCP Global Summit held from October 13-16 in San Jose, California.

The Evolution of Two-Phase Cold Plate Design

ZutaCore OmniTherm represents a major advancement in two-phase cold plate design, specifically addressing the needs of orientations that were previously overlooked, such as inverted settings and unconventional server configurations. This innovation aims to redefine how thermal flexibility is achieved in environments characterized by complex layouts and high-density component placements.

Designed to cater to the unique challenges posed by advanced AI workloads, OmniTherm delivers performance that is not just efficient but also adaptable, proving essential for modern computing frameworks including cloud infrastructure. The technology draws on ZutaCore's patented pool-boiling technology, enabling heat transfer directly from the chip surface at vastly improved efficiency compared to traditional cooling methods.

Flexibility Across All Orientations

One of the standout features of the OmniTherm is its ability to perform effectively in multiple orientations, whether vertical, horizontal, or fully inverted. This capability is crucial for data centers that utilize edge, modular, blade, or high-density systems. The technology facilitates back-side power delivery cooling, which allows effective thermal management not only for AI accelerators but also for PCIe cards and other essential components.

No Redesign Required

Installation of the OmniTherm is straightforward; it seamlessly fits into existing server footprints without necessitating mechanical redesigns or infrastructure changes. This aspect reduces the time needed to bring new systems to market, allowing operators to adapt to market demands swiftly. The versatility of OmniTherm extends beyond individual server environments, supporting a cohesive cooling strategy across diverse platforms, including hyperscale, enterprise, and edge settings.

Built on Proven Waterless Technology

What truly differentiates ZutaCore is its commitment to waterless cooling solutions. The OmniTherm system employs a non-conductive, non-corrosive dielectric fluid, which instantly absorbs and dissipates heat at the chip level. This design prioritizes safety, ensuring reliable operation even in the event of an unlikely leak.

ZutaCore not only focuses on performance; their solutions are also aligned with sustainability efforts, aiming for net-zero emissions in data centers without the need for water as a coolant.

Insights from Industry Leaders

According to Alex Cordovil, Research Director at Dell'Oro Group, “As AI workloads surge, the paradigms of data center design are transforming. The introduction of high-amperage in-rack DC busbars within AI architectures come with challenges that ZutaCore's innovations are equipped to tackle.” Cordovil recognizes that as architectural demands evolve, there will be an increased need for cooling solutions capable of managing extreme heat flux and design flexibility.

Meanwhile, My D.Truong, CTO at ZutaCore, emphasizes, “OmniTherm represents a pivotal advancement in thermal innovation. With this technology, we enable data centers to not only adapt their design but run future compute loads on existing infrastructures without compromise.”

In summary, the ZutaCore OmniTherm signalizes a considerable advancement in cooling technology tailored for the demands of contemporary computing infrastructures. As data centers continue to evolve, solutions like OmniTherm are poised to redefine how thermal management is approached, ensuring efficiency, flexibility, and sustainability concurrently.