#Taiwan #Taipei #FLEX #AI Infrastructure #COMPUTEX 2026

Flex Revolutionizes Power Solutions for AI Infrastructure at COMPUTEX 2026

At this year’s COMPUTEX 2026, Flex showcased a series of cutting-edge power solutions that are set to redefine the infrastructure of next-generation AI applications. The spotlight was on their new 110 kW power shelf tailored for the NVIDIA Vera Rubin NVL72 platforms, in addition to a 30 kW Capacitive Energy Storage System (CESS) and the sleek BMR317 intermediate bus converter designed for high-density computing environments.

With AI technology rapidly evolving, there's an increasing need for data centers to adapt, with particular emphasis on enhancing power density and managing complex infrastructure effectively. Flex’s newest offerings are designed to not only improve efficiency in these environments but also support the transition towards 800 VDC power architectures.

Major Highlights from Flex's Presentation

1. 110 kW Power Shelf:
The formidable 110 kW power shelf supports scalable distribution specifically for NVIDIA's Vera Rubin NVL72 platforms, facilitating an effective power disaggregation model. This design is pivotal for maximizing GPU density within IT racks, ultimately leading to increased infrastructure efficiency. It serves as a fundamental building block for future 800 VDC deployments, fostering an environment where AI technologies can thrive.

2. 30 kW CESS:
The introduction of the 30 kW CESS represents a substantial leap forward in stabilizing power for dynamic AI workloads. This energy storage system is adept at smoothing out transient AI demands and ensuring power quality across both traditional AC systems and new 800 VDC environments. Compatibility with battery energy storage systems (BESS) enhances its utility, positioning it as an invaluable accessory to modern data center setups, with versatility for deployment in both 19-inch and 21-inch rack configurations.

3. BMR317 Intermediate Bus Converter:
The BMR317 expands Flex’s portfolio with a compact, high-efficiency power module, tailored for high-density compute scenarios encountered in accelerator cards, servers, and various xPU platforms. This product is particularly designed to support the rapid and fluctuating power demands characteristic of dynamic AI processing workloads, ensuring that efficiency and performance remain uncompromised.

Flex’s innovations were presented as part of their broader commitment to providing flexible, high-density power solutions that meet the surging demands of AI at data centers. As highlighted by Chris Butler, President of Embedded and Critical Power at Flex, the need for advanced power infrastructure is imperative with the explosive growth of AI technologies. The company continuously strives to enhance the scalability and performance of AI-driven infrastructure, paving the way for better efficiency and higher performance.

The Future of Power Infrastructure

These power solutions are not mere products but integral tools enabling customers to build and scale their power infrastructures suitable for the most demanding AI workloads. By developing solutions designed for both current needs and future demands, Flex solidifies its reputation as a leader in the realm of power management for high-density environments.

As AI applications continue to proliferate, the reliability and efficiency of data center operations become non-negotiable. Flex's innovative portfolio, exhibited at COMPUTEX 2026, underscores its pivotal role in helping partners overcome contemporary challenges related to power supply and management in the evolving landscape of AI.

If you’re interested in learning more about Flex's advanced power solutions or how they can benefit your AI infrastructure, visit Flex’s website to explore their diverse offerings further.