FIC Global Showcases Innovative Optical Transceiver Technologies at APE 2026

FIC Global, Inc., listed on the Taiwan Stock Exchange under the code 3701, is all set to participate in the upcoming Asia Photonics Expo (APE) 2026, scheduled from February 4 to 6 at the Sands Expo and Convention Centre in Singapore.

As part of its optical communications brand, PRIME Technology, FICG will prominently display its manufacturing capabilities for high-speed optical transceivers and advanced packaging integration at Booth A521. The focus will be on addressing the growing demand for higher bandwidth in data centers, particularly in light of the increased data flow driven by artificial intelligence (AI) workloads.

The rapid evolution of AI is propelling data center operations into a new generation of efficiency. As AI training and widespread deployment experiences significant growth from late 2025 into the following year, companies are facing an urgent need to optimize not just computational resources but also network efficiency and overall cluster performance. The current trend indicates a shift towards expansive deployments of 800G technology, with early production adoption seen in the emerging 1.6T category, thanks to advances in optical connectivity and energy efficiency.

Recognizing these trends, FICG has over 18 years of experience in the production of optical transceivers, making it one of the pioneers in implementing surface-mount technology (SMT) in the manufacturing process. To keep pace with the increasing requirements for next-generation high-speed interconnects, the company has enhanced its advanced packaging capabilities, which include Flip-Chip, Chip-on-Board (COB), Silicon Photonics (SiPh), and Co-Packaged Optics (CPO). These advancements are supported by rigorous high-speed signal engineering, comprehensive reliability testing, and a robust quality control system. As a result, FICG enables its clients to shorten qualification cycles, enhance deployment timelines, and improve production stability and quality consistency.

In embracing the transition to the 800G and 1.6T paradigms, FICG has introduced flip-chip packaging techniques to its high-speed optical transceiver manufacturing processes. Additionally, advancements in Photonic Integrated Circuits (PIC) and Photo Detector (PD) integration have been made to help clients boost interconnect bandwidth and energy efficiency, all while improving system scalability. The company has established a comprehensive set of process capabilities and quality control flows that encompass the manufacturing process from the chip level to module assembly, ensuring consistent volume manufacturing and dependable delivery.

Further enhancing its global delivery and supply chain resilience, FICG is upgrading its manufacturing site in Malaysia. This facility is prepared for large-scale production with a complete quality management framework, complementing existing production lines and improving capacity and delivery efficiency.

FIC Global warmly invites industry professionals to visit Booth A521 during APE 2026. Attendees will have the opportunity to engage in discussions surrounding high-speed optical transceiver integration processes, advanced packaging techniques, and support solutions for volume production. This is a fantastic chance for collaboration in the ever-evolving landscape of AI and data center interconnects. As the demand for more powerful and efficient optical transceivers grows, FICG remains committed to providing innovative solutions that meet the industry's needs.