#Belgium #Leuven #EV Group #Hybrid Bonding #Imec

Imec and EV Group's Innovative Wafer-to-Wafer Hybrid Bonding Technology

In a remarkable development for semiconductor technology, Imec and EV Group (EVG) have unveiled a groundbreaking wafer-to-wafer hybrid bonding technology, demonstrating a 200nm interconnect pad pitch and unprecedented overlay accuracy. This achievement was showcased at the 2026 IEEE Electronic Components and Technology Conference (ECTC), where the two organizations highlighted their continuous collaboration focused on enhancing the overlay performance necessary for advanced logic-to-logic and memory-to-logic tier stacking.

The Significance of the Breakthrough

The successful integration of these technologies marks a significant milestone in the ongoing evolution of the semiconductor industry, particularly in enabling tier stacking that requires exceptionally high interconnect densities. Imec's CMOS 2.0 scaling paradigm envisions a new approach to semiconductor design, where system-on-chip (SoC) architectures are partitioned into distinct, yet interconnected layers.

At the heart of this development is the ability to achieve a post-bond alignment accuracy record using routable interconnects on a test vehicle. The research team successfully co-optimized the critical components of the wafer-to-wafer hybrid bonding process. This involved leveraging EVG's state-of-the-art wafer bonding equipment, which played a crucial role in attaining the impressive results.

Advancements in Hybrid Bonding Technology

The details of this hybrid bonding process include using significant innovations in dielectric materials, specifically SiCN, and implementing a meticulously refined chemical mechanical polishing (CMP) step prior to the bonding phase. This step ensured high uniformity across the wafer, producing ultra-flat dielectric surfaces and achieving controlled recess for the copper pads. The resulting overlay accuracy—under 40nm for all dies across a 300mm wafer—represents a world-first in the industry.

Zsolt Tokei, an esteemed fellow at Imec and program director for 3D system integration, stated, “This breakthrough was only achievable by optimizing all critical elements in our hybrid bonding process. The success of this technology is essential for unlocking the advanced applications we envision.”

Future Directions

As the industry moves towards 200nm interconnect pitches, Tokei emphasized the intention to push the boundaries of wafer-to-wafer hybrid bonding below this threshold to accommodate increasingly demanding logic-to-logic and memory-to-logic use cases. Continuous enhancements in overlay performance will be paramount to succeed in these initiatives.

Paul Lindner, executive technology director at EVG, noted, “Our longstanding partnership with Imec underscores the vital role of wafer bonding technology in powering next-generation semiconductor devices. Over the decades, our collaborative efforts have yielded significant advancements in process technology, paving the way for the future of semiconductor applications.”

This robust collaboration illustrates the synergy between a leading research organization and an innovative equipment supplier, catalyzing breakthroughs that could reverberate throughout the semiconductor ecosystem.

With a strategic focus on advancing semiconductor technology, both companies are set to lead the charge toward the next generation of advanced computing systems. The results presented at ECTC 2026 represent just a glimpse of the potential capabilities of next-generation semiconductor technology through successful partnerships.

About Imec and EV Group

Imec is recognized worldwide as a research and innovation hub specializing in semiconductor technologies, providing transformative solutions across various sectors. Meanwhile, EV Group offers pioneering process solutions tailored for cutting-edge semiconductor designs, emphasizing their operational experience and commitment to ongoing innovation in micro- and nanofabrication technologies.

In summary, the collaborative efforts between Imec and EVG embody the spirit of innovation needed to drive the semiconductor industry forward, unlocking new possibilities for future technologies.