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JCET Group's Impressive Performance in 2025 Annual Report

On April 9, 2026, JCET Group (SSE: 600584), a premier global player in integrated circuit (IC) back-end manufacturing and technology services, unveiled its 2025 Annual Report. The report showcased a stellar achievement with a record full-year revenue of RMB 38.87 billion, a significant increase of 8.1% compared to the previous year, alongside a notable profit before tax (PBT) of RMB 1.74 billion, marking a 5.4% year-on-year rise. The profit attributable to shareholders reached RMB 1.57 billion, underlining the company's robust financial health.

In the fourth quarter of 2025 alone, revenue peaked at RMB 10.2 billion, reflecting a quarterly growth of 1.4%. Impressively, net profit for the same quarter surged to RMB 610 million, which represents a remarkable 26.6% increase from the preceding quarter. This performance highlights JCET's consistent growth trajectory, as it has seen an upward momentum in revenue for the third consecutive year, following a strategy of steady and progressive operation.

The report indicates that JCET's operational stability across domestic and international platforms contributed significantly to its success. The company's high capacity utilization reflects its efficient management practices, particularly in advanced packaging solutions, including wafer-level packages, which reached an all-time revenue high of RMB 27 billion. Over the year, JCET has amplified its investments in cutting-edge advanced packaging technologies and their associated production capacities. This move, while leading to some temporary cost pressures due to fluctuating raw material prices, has concurrently improved product pricing and margins through the scaling of higher value-added solutions.

As we look forward, JCET is committed to aligning its investments with market demands and focusing on pioneering technologies and critical capacity expansions. This approach positions them favorably as they seek to enhance their competitiveness in the mid-to-long-term landscape.

From an application standpoint, JCET has strategically strengthened its standing in rapidly expanding sectors such as high-performance computing, storage solutions, automotive electronics, and power management systems. The company has been proactive in introducing and mass-producing emerging products like co-packaged optics (CPO), vertical power delivery modules, and intelligent driving applications. Revenue breakdowns reveal robust growth across various sectors, with increases of 42.6% in computing electronics, 40.6% in industrial and medical electronics, and 31.7% in automotive electronics, compared year-on-year.

In 2025, JCET facilitated the operational readiness of JCET Automotive (Shanghai) Co., Ltd. to support high-grade automotive and robotics applications. Moreover, JCET Microelectronics (Jiangyin) Co., Ltd. rapidly evolved its production capabilities in response to growing demand for sophisticated intelligent applications, indicating JCET’s forward-thinking approach to market needs.

In the realm of research and development, JCET has achieved noteworthy advancements in key packaging technologies and fostered collaborative innovations throughout the supply chain. The total research and development expenses rose to RMB 2.09 billion, a substantial annual increase of 21.4%, reflecting their commitment to pioneering advancements in critical technology areas like high-density multi-dimensional heterogeneous integration and advanced bonding techniques. By focusing on accelerating the transition of R&D accomplishments into scalable manufacturing and commercial applications, JCET sustains its commitment to fostering an innovative advanced packaging ecosystem.

In 2026, JCET's CEO, Mr. Li Zheng, emphasized the company's dedication to harnessing growth opportunities in high-performance computing, storage, and embodied intelligence. Their aim is to expedite the realization of technological breakthroughs into mass-production capabilities while improving the efficiency of high-end capacities. This multifaceted approach underpins JCET’s ambition in securing long-term growth and enhancing core competitive advantages.

For additional insights, refer to the JCET FY2025 Report for comprehensive details on their operational excellence and future outlook.

About JCET Group

JCET Group stands as a preeminent leader in the realm of integrated circuit back-end manufacturing and technology services, offering a complete suite of solutions, including semiconductor package integration design, wafer probing, bumping, assembly, final testing, and global drop shipment. Their innovative techniques encompass advanced wafer-level packaging, 2.5D/3D packaging technologies, and System-in-Package solutions, spanning multiple applications across automotive, artificial intelligence, and high-performance computing sectors. With production facilities in China, Korea, and Singapore, they maintain efficient supply chain strategies and strong partnerships with clients worldwide.