PCBAIR Launches Cutting-Edge 8-Layer Glass Core PCB for AI Technologies

PCBAIR Unveils Advanced Glass Core PCB Technology for AI and HPC

On December 8, 2025, PCBAIR, a front-runner in PCB manufacturing, revealed its new 8-layer Glass Core PCB capabilities designed specifically for artificial intelligence (AI) and high-performance computing (HPC) applications. This innovative approach leverages proprietary Through Glass Via (TGV) technology alongside multi-layer redistribution layers (RDL) to offer a solution that addresses the growing demands for superior signal integrity and thermal stability.

Emphasizing Performance

The latest glass substrates developed by PCBAIR tackle critical interconnect density issues that traditional organic substrates often struggle with, especially in the fast-evolving realms of AI and HPC. Engineered for a variety of applications, including AI accelerators, high-speed data center servers, and optical transceivers, these new PCB structures enable finer line widths and tighter spacing. Pilot production and customer sampling for these ground-breaking PCBs are starting promptly, signaling a significant advancement in PCB technology.

Victor Zhang, PCBAIR's Chief Technology Officer, stated, "We're proud to launch this innovative 8-layer Glass Core PCB technology, representing a substantial leap forward in advanced packaging solutions. By shifting from organic to glass core substrates, we lay down a stable foundation for the industry's rigorous computing workloads. Our partners can expect the precision and reliability they rely on greatly enhanced."

Innovative Technology Features

The development of PCBAIR's high-density interconnect solutions hinges on several technical breakthroughs involving glass processing, metallization, and stacking techniques:

1. Precision TGV Technology: Achieving TGV diameters of below 20 μm and a pitch under 100 μm enables significantly increased I/O density compared to standard organic substrates. This improvement facilitates more efficient vertical signal transmission between chiplets, crucial for high-speed applications.
2. Optimized Stack-Up Design: The company employs a symmetric build-up structure—often a 3-2-3 or 4-Core-4 stack—to effectively manage internal stress, which guarantees exceptional flatness and minimizes warpage issues often encountered during the assembly of large AI chipsets.
3. Enhanced Electrical Performance: The glass core material is characterized by a low dielectric loss (Df < 0.002), which reduces insertion loss significantly. This enhancement translates to approximately a 15%-20% increase in signal transmission efficiency for high-frequency applications—an essential feature for future 112G and 224G SerDes links.
4. Superior Thermal Management: The thermal expansion coefficient (CTE) of the glass core closely matches that of silicon dies. As a result, this minimizes stress on solder joints during thermal cycling, thereby improving the long-term reliability of the packaged devices.

Together, these improvements enable chip designers to navigate the existing packaging bottlenecks, boosting performance without the significant cost increments associated with traditional silicon interposers.

Adoption and Compatibility

One particularly significant aspect of PCBAIR's Glass Core PCBs is their compatibility with existing substrate assembly lines. This feature assures clients of a seamless transition towards adopting glass-based technology. The company also provides a turnkey solution, overseeing the delicate processes required for manufacturing and assembling glass substrates, thus mitigating supply chain risks for global partners.

Established in 2014, PCBAIR has consistently positioned itself as a leading PCB manufacturer and assembly service provider, focusing on high-reliability electronics. The company is committed to offering comprehensive solutions—ranging from rapid prototyping to high-volume manufacturing. With certifications including IATF 16949, ISO 13485, and ISO 9001, PCBAIR strictly adheres to IPC-A-610 and J-STD-001 standards while ensuring compliance with environmental and safety regulations via UL, RoHS, and REACH certifications.

For further details on PCBAIR and its innovative products, you can visit their official website at www.pcbair.com.