#USA #Fremont #Yield Engineering Systems #VertaCure #AI Packaging

YES Introduces the VertaCure XP G3 Systems

Yield Engineering Systems (YES), a prominent player in the manufacturing of process equipment tailored for AI and high-performance computing (HPC) semiconductor solutions, has announced the launch of its latest innovation: the VertaCure XP G3 curing systems. These advanced curing systems are set to enhance manufacturing capabilities for state-of-the-art packaging solutions which are vital in today’s semiconductor landscape.

The VertaCure XP G3 represents a significant evolution in YES’s product lineup, designed particularly for low-temperature curing across multiple redistribution layer (RDL) applications in 2.5D and 3D packaging. One of the critical advantages of this tool architecture is its optimization for high-throughput hybrid bonding anneal solutions, ensuring it meets the increasing demands of the semiconductor industry.

Key Features and Benefits

The VertaCure XP G3 is a fully automated six-zone vacuum curing system that excels in several areas:

• - Complete Removal of Residual Solvents: Ensuring the quality and reliability of the curing process.
• - Uniform Temperature Distribution: This guarantees consistent results across all layers being cured, crucial in complex semiconductor packaging.
• - Precise Management of Heating and Cooling Rates: Critical for applications requiring specific thermal profiles.
• - Minimal Outgassing After Cure: This protects the integrity of the semiconductor products throughout processing.
• - Outstanding Particle Performance: Essential for maintaining high standards in semiconductor manufacturing.

Moreover, this advanced system achieves remarkable thermal uniformity with a variance of just ± 1°C at temperatures exceeding 200°C during the dwell and ramp phases, an important factor for the curing of thick films made from Polyimide (PI).

Saket Chadda, Senior Vice President at YES, stated, "The VertaCure XP G3 is a production-proven automated vacuum curing system that not only ensures superior film performance but also far surpasses atmospheric curing in terms of efficiency and throughput. With a six-zone temperature control system and laminar flow, it ensures excellent uniformity and particle management essential for curing materials like Polyimide, PBO, and epoxy. These attributes are particularly critical for applications in AI and high-performance computing."

Alex Chow, Senior Vice President of Business Development and Marketing, noted the significance of the VertaCure line in fostering a reproducible, scalable manufacturing process. He emphasized that the product is engineered for both Wafer-to-Wafer and Die-to-Wafer bonding applications, establishing YES’s leadership in the market for curing tools. This is underscored by the product’s ability to provide superior quality while delivering a competitive total cost of ownership (CoO) for manufacturers of advanced semiconductor packaging.

About YES

YES is recognized for its differentiated technologies essential for materials and interface engineering spanning numerous applications and sectors. With a focus on next-generation solutions, YES serves markets within Advanced Packaging for AI and HPC, Memory Systems, and Life Sciences. Headquartered in Fremont, California, YES continues to expand its global footprint, offering cutting-edge, cost-effective manufacturing equipment that meets the complex needs of the semiconductor industry. Their diverse product offerings include innovative Vacuum Cure, Coat and Anneal Tools, Fluxless Reflow tools, and other essential equipment for both wafer and glass panel applications.

For additional details on YES and its upcoming products, visit YES.tech.