#USA #Los Angeles #Edge AI #ECS-DoT #EMASS

EMASS Unveils Revolutionary 16nm ECS-DoT SoC

In a significant leap for the semiconductor industry, EMASS, a subsidiary of Nanoveu, has made headlines with the announcement of its next-generation ECS-DoT system-on-chip (SoC) based on a cutting-edge 16nm process node. This advancement follows on the heels of the company's existing 22nm ECS-DoT offering and promises to position EMASS at the forefront of ultra-low-power edge AI technologies. The new SoC is currently nearing completion, entering critical phases of graphic data system (GDS) sign-off, tape-out, and eventual fabrication at the renowned TSMC facility.

Enhancing Edge Technology

The move to a 16nm node marks a pivotal moment in EMASS's commitment to pushing the boundaries of edge technology. With improvements in performance, energy efficiency, compute power, and on-chip resources, the ECS-DoT family is set to redefine the capabilities of always-on intelligence. The device seamlessly integrates various features, such as an advanced on-chip Bluetooth Low Energy (BLE) subsystem and a sophisticated power management system designed to enhance processing power and efficiency.

Mark Goranson, CEO of EMASS, emphasizes the significance of this transition: "With the 16nm ECS-DoT, we reach a defining moment for EMASS as we scale our architecture into new classes of applications demanding more intelligence, more speed, and even lower power." This encapsulates the essence of the device's design, aimed at unlocking new applications in machine learning without compromising battery life or device dimensions.

Key Features of the 16nm ECS-DoT

One of the standout attributes of the 16nm ECS-DoT is its fully integrated BLE subsystem, which not only streamlines the design process but also reduces the need for external wireless components. This integration results in a decrease in board area, overall costs, and design complexity. Additionally, the SoC boasts expanded on-chip memory, allowing the handling of larger AI models while minimizing off-chip memory access—ultimately leading to higher efficiency.

For always-on, battery-powered, and energy-harvesting applications, an adaptive fine-grained power management architecture optimizes energy use without adding complexity. Furthermore, the inclusion of a dedicated object-detection accelerator enhances throughput and reduces inference latency, a crucial factor for edge vision applications. The integrated floating-point unit allows for accelerated DSP and mixed-precision AI workflows, streamlining the development process.

Developer-Focused Advantages

What sets the 16nm ECS-DoT apart is its seamless upgrade path for developers. By maintaining complete compatibility with the existing ECS-DoT software and workflow, developers can transition from 22nm to 16nm with minimal redesign. This compatibility not only supports larger workloads but also enhances the functionality of ultra-low-power operations, thereby catering to the growing demand for efficient edge applications.

Strengthening EMASS’s Vision

Beyond its technological capabilities, the 16nm ECS-DoT aligns with EMASS’s vision of connecting silicon architecture, algorithm design, application needs, and real-world deployment into a cohesive development philosophy—known as the "Atoms-to-Apps" approach. Founder and CTO, Dr. Mohamed Sabry, stated, "This next generation of ECS-DoT represents a significant architectural advance for EMASS, bringing together always-on intelligence, deeper on-chip resources, and higher levels of integration within a single ultra-low-power Edge AI platform."

About EMASS and Nanoveu

EMASS specializes in crafting advanced semiconductor solutions with an emphasis on ultra-low-power AI systems for edge computing. Its flagship product, the ECS-DoT chip, is renowned for providing high-performance AI processing capabilities for various applications, including healthcare devices and IoT systems, while maximizing energy efficiency. Nanoveu, the parent company, is dedicated to enhancing human-machine interactions through a broad spectrum of advanced technology, including ultra-low-power AI and glasses-free 3D technologies. Their commitment to innovation is evident in the way they are shaping the future of smart devices and applications, making life smarter, safer, and more immersive.