#Israel #Tel Aviv #Data Center #NewPhotonics #AI chiplet

NewPhotonics Launches Industry-First NPO Chiplet

In the fast-evolving world of data connectivity, NewPhotonics® Ltd. has made a significant leap forward by introducing the NPC50503, a pioneering serviceable Near-Packaged Optics (NPO) chiplet solution. This innovative product is designed to handle 1.6 terabits per second (Tbps) of data, catering specifically to the increasing demands of modern AI factories that require high-speed, efficient data transfer capabilities.

Key Features of the NPC50503 Chiplet

The NPC50503 NPO integrates a laser with a patented OSPic™ all-optical signal processor, positioning it as a market leader in terms of performance and efficiency. This integration is particularly noteworthy, as it allows for seamless interoperability with existing systems while reducing power consumption, a critical factor in today’s energy-conscious technological landscape.

Among its key features, the NPC50503 boasts:

• - Heterogeneously Integrated Lasers: This design enables high coupling efficiency, crucial for maintaining signal integrity over long distances.
• - Low Power Consumption: The chiplet operates with a power-efficient flip chip BGA, streamlining complex assembly processes and contributing to reduced operational costs.
• - High Bandwidth through 224 Gbps High-Bandwidth PAM4: This standard is compliant with the 802.3dj specification, ensuring robust performance in high-demand environments.
• - Enhanced RF Link-Budget: The chip delivers an 8 dB improvement over the traditional 21 dB long-channel baseline.
• - Comprehensive Monitoring Capabilities: Each channel can be monitored for output power, with options to disable transmission as needed.

Addressing Modern Data Challenges

According to Doron Tal, Senior Vice President and General Manager of NewPhotonics, the NPC50503 chiplet is designed to meet the challenges posed by AI systems needing 200 Gbps per lane and beyond. The combination of power efficiency, operational control, and signal integrity contributes to an architecture that is not only modular and serviceable but also pivotal in addressing current system scalability issues.

The NPC50503 chiplet is set to redefine expectations in data center interconnectivity. Specifically, its compact size and enhanced performance make it ideal for placement alongside graphics processors (GPUs) and AI accelerators, optimizing space and resource utilization in high-performance computing environments.

Upcoming Demonstration

NewPhotonics will showcase this cutting-edge technology at the Optical and Fiber Communications (OFC) conference in Los Angeles, scheduled for this March. Attendees will have the opportunity for a private demonstration of the NPC50503 NPO laser integrated transmitter.

For more information about NewPhotonics and the NPC50503 chiplet solution, please visit NewPhotonics.com.

Conclusion

With the launch of the NPC50503, NewPhotonics reaffirms its position as a front-runner in the semiconductor industry, particularly within the realm of photonic integrated circuits (PICs) for data center interconnectivity. The innovative designs and technologies are expected to facilitate a new era in data processing, particularly as industries increasingly pivot towards AI and machine learning technologies. Organizations looking to enhance their data center capabilities in an energy-efficient manner will likely find this technology invaluable.