#United States #Wilmington #DuPont #Pyralux ML #NPI Award

DuPont™ Pyralux® ML Series Earns Recognition

DuPont has officially unveiled that its innovative Pyralux® ML Series has been honored with the prestigious 2025 NPI Award by Circuits Assembly, highlighting its remarkable contributions to the electronics assembly industry. This award is a testament to the groundbreaking technology embedded in the Pyralux® ML double-sided metal-clad laminates.

Launched in April 2024, these laminates serve as a significant extension of the well-regarded Pyralux® family, specifically crafted for flexible and rigid-flex printed circuit boards (PCBs). Notably engineered for superior thermal management, the Pyralux® ML laminates are especially suited for high-reliability sectors including aerospace, defense, and the booming electric vehicle (EV) market. They are also compatible with artificial intelligence (AI) networking and various other electronic devices, demonstrating their versatility and innovation.

The NPI Award recognizes products that stand out in terms of creativity, innovation, cost-effectiveness, and overall performance. Evaluated by a panel of independent engineering experts from the industry, it underscores the Pyralux® ML laminates’ compatibility with existing technologies along with their design and user-friendliness. DuPont's latest offering is particularly distinguished for its unique composition featuring copper-nickel (CuNi) metal alloys integrated with Kapton® all-polyimide dielectric technology. This combination optimizes resistivity for higher heat output and minimizes thermal conductivity, facilitating improved heat management across various applications.

The positive feedback surrounding internally evaluated criteria showcases the advantages of Pyralux® ML in demanding applications; their high-performance standards are critical in sectors where reliability is non-negotiable.

Thean Ming Tan, Global Business Director of Advanced Flex Technologies in DuPont Interconnect Solutions stated, “We are extremely honored that our Pyralux® team has been acknowledged for their phenomenal efforts and innovation. This award not only highlights the technological advancements we’ve made but also marks Pyralux® ML as the leading product in optimizing thermal management for high-performance industries.”

DuPont Interconnect Solutions is set to present its advanced product lineup and share insights at the IPC APEX Expo, where they will feature exciting discussions in the Insulectro Technology Village, Booth 4138. This event presents an ideal platform for industry professionals to learn more about Pyralux® ML and other groundbreaking technologies developed by DuPont.

For further details about this award-winning product and the extensive range of solutions offered by DuPont, you can visit the official Circuits Assembly website. More about DuPont’s commitment to innovation and their expansive portfolio can be found on their official website.

In summary, DuPont’s Pyralux® ML series not only exemplifies technical excellence but also embodies the kind of forward-thinking solutions that are essential to the future of electronics manufacturing. With the ever-increasing demands for high-reliability components in various domains, this award serves as a significant milestone for DuPont and its stakeholders in continuing to push the boundaries of innovation.