Siiibo at Fintech 2026
2026-03-03 07:00:32

Siiibo Securities' CEO to Speak at Japan Fintech Week 2026 on Corporate Bond Market

Siiibo Securities CEO Kazuki Okumura Takes Center Stage at Japan Fintech Week 2026



The upcoming Japan Fintech Week 2026 will see a significant contribution from Siiibo Securities, a company making waves in the finance industry with its innovative platform for corporate bonds, aptly named Siiibo. On March 6, 2026, CEO Kazuki Okumura will participate in a roundtable discussion titled "Will the 'Frontier' Corporate Bond Market Flourish and Lead Individuals from 'Savings to Investment'?" This event is a collaboration between the Financial Services Agency and the Japan Fintech Association aimed at exploring the evolving landscape of corporate bonds in the country.

As a platform that allows individual investors to directly engage with corporate bonds, Siiibo is pioneering efforts to reshape how bonds are perceived and purchased in Japan. The discussion led by Okumura will delve into the recent surge in corporate bond issuance, which in 2025 reached an unprecedented total in yen-denominated bonds and saw individual bond investments surpass 2.7 trillion yen. The growing interest in corporate bonds reflects a broader societal shift towards investment rather than mere savings, a theme central to the roundtable discussion.

Japan Fintech Week 2026: Bridging Opportunities


Japan Fintech Week 2026 is scheduled from February 24 to March 6, 2026, and aims to showcase the attractiveness of Japan's fintech industry to the world while creating business opportunities for further development. This event marks the tenth edition of FIN/SUM, co-hosted by the Financial Services Agency and the Nihon Keizai Shimbun. It seeks to gather stakeholders from both domestic and international fintech sectors, fostering dialogue and collaboration.

The roundtable featuring Okumura is expected to attract participants from various sectors, offering a multi-faceted discussion on the changes in the corporate bond market. Key considerations will focus on corporate bonds as a viable fundraising method for startups and as an essential asset-building tool for individual investors.

Event Details


The roundtable session, organized by the Japan Fintech Association, is free of charge and will be held at the Conference Square M+, located in Chiyoda, Tokyo. Here are the essential details:
  • - Date & Time: March 6, 2026, from 17:00 to 18:00
  • - Venue: Conference Square M+, 10th Floor Mitsubishi Building, 2-5-2 Marunouchi, Chiyoda, Tokyo
  • - Registration: While primarily aimed at association members, anyone with a FIN/SUM ticket can attend without a reservation. Members can apply via Peatix.

About Kazuki Okumura


Kazuki Okumura brings a wealth of experience to Siiibo. Prior to his role as CEO, he served as a trader at Deutsche Securities, where he managed various credit products, including corporate bonds. His advisory work at BlackRock Japan further strengthened his expertise in investment processes and risk analysis. Following the establishment of Siiibo in 2019, Okumura has been instrumental in guiding the company towards its mission of creating a transparent and accessible direct financing landscape through corporate bonds.

Siiibo Securities Overview


Operating under the mission of fostering freedom, transparency, and fairness in direct finance, Siiibo stands out as Japan's only online securities platform dedicated to corporate bonds. Investors can utilize the Siiibo platform to access corporate information and manage bond purchases efficiently, while companies benefit from IR postings and issuance support.

Company Name: Siiibo Securities Co., Ltd.
Address: 8-1 Kabutocho, Nihonbashi, Chuo City, Tokyo 103-0026
Founded: January 11, 2019
Capital: 16.2759 billion yen (as of February 2025)
Website: siiibo.com

With a pioneering approach and a focus on corporate bonds, Siiibo Securities continues to shape the investment landscape in Japan, and Okumura's insights during the Japan Fintech Week are highly anticipated.


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Topics Business Technology)

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