#Japan #Axcelis Technologies #Yokohama #SiC #Epitaxial Layers

Axcelis Technologies Joins ICSCRM 2026

Axcelis Technologies, Inc., recognized as a leader in ion implantation solutions for the semiconductor industry, proudly announces its upcoming involvement in the 23rd International Conference on Silicon Carbide and Related Materials (ICSCRM 2026). This esteemed event is scheduled to take place from September 28 to October 2, 2026, at the Pacifico Yokohama North in Japan.

The conference serves as a vital platform for industry leaders, researchers, and technologists to communicate advancements and challenges in silicon carbide (SiC) technologies. Axcelis will feature prominently at the conference with an exhibit located at Booth #F3. The company's team of experts will engage attendees and share insights into pioneering technologies shaping the future of power devices.

At this year's conference, Axcelis will deliver presentations centered around key industry topics, including:

• - Suppression of Stacking Fault Expansion in SiC Epitaxial Layers via Substrate Implantation
• - n-Type 4H-SiC Contact Engineering by Implantation-Annealing Co-Optimization
• - Manufacturability of Single Epi Step 1200V SiC Superjunction Pillars Using Channeling Ion Implantation
• - Sensitivity of SiC Superjunction MOSFET Performance to High-Energy Implantation of p-Pillars

Dr. Russell Low, President and CEO of Axcelis, expressed enthusiasm about the participation in ICSCRM 2026, stating, "As a leading provider in ion implantation solutions for power devices, we are thrilled to be part of one of the premier technology forums for the power device market. Our presence at the conference underscores our commitment to supporting advancements in this dynamic sector. Our Purion Power Series+™ platform exemplifies our advanced process control and capabilities in ion implantation, crucial for silicon carbide device manufacturing."

The market for silicon carbide devices is projected to flourish, with estimates from the Yole Group suggesting it will reach $11 billion by 2031, experiencing a significant compound annual growth rate (CAGR) of 20% from 2025 to 2031. This growth highlights the importance of ion implantation, a critical step in the fabrication process of SiC devices, further validating the contributions Axcelis brings to the industry.

For nearly 50 years, Axcelis has been committed to providing innovative, high-productivity solutions tailored for the semiconductor sector. The company is focused on developing application-driven processes through the design, manufacture, and comprehensive lifecycle support of ion implantation systems. These systems constitute one of the most essential elements of integrated circuit manufacturing, essential for the modern electronic landscape.

Attendees of ICSCRM 2026 are encouraged to visit Axcelis at Booth #F3 to engage with technology experts and explore the groundbreaking solutions offered by the company. To learn more about Axcelis Technologies and its pioneering work in the semiconductor space, please visit www.axcelis.com.

Contact Details:
Investor Relations Contact:
David Ryzhik
Senior Vice President and Interim CFO
Telephone: (978) 787-2352
Email: [email protected]

Press/Media Relations Contact:
Maureen Hart
Senior Director, Corporate Marketing Communications
Telephone: (978) 787-4266
Email: [email protected]

As technology continues to evolve, Axcelis remains at the forefront of innovation in the semiconductor industry, dedicated to enhancing the performance and efficiency of power devices globally.