#Japan #Packaging #Tokyo #Semiconductor #CMC Research

Upcoming Live Seminar on Semiconductor Packaging Technology

In the ever-evolving realm of technology, understanding semiconductor packaging is crucial for professionals engaged in this dynamic industry. CMC Research, renowned for providing insights into advanced technology and market trends, will host a comprehensive live seminar titled "Fundamentals of Semiconductor Packaging Technology and Advanced Semiconductor Packaging Techniques". This event will occur on August 8, 2025, from 1:30 PM to 4:30 PM JST, utilizing the Zoom platform for virtual attendance.

Seminar Details

The seminar features Shigeru Koshibe, the CEO of iPack, an established expert in semiconductor packaging materials. The registration fee is structured as follows:

• - General Admission: ¥44,000 (tax included)
• - CMC Newsletter Subscribers: ¥39,600 (tax included)
• - Academic Rate: ¥26,400 (tax included, includes materials)

Participants can expect not only an in-depth exploration of semiconductor packaging technology but also an interactive Q&A session, encouraging engagement and discussion among attendees.

Knowledge to be Gained

Attendees will acquire essential insights including:

• - Fundamental knowledge of semiconductor packaging
• - Understanding of materials used in semiconductor packaging
• - Awareness of historical development and trends in semiconductor packaging technology

Target Audience

This seminar is aimed at anyone involved in the semiconductor sector, including engineers, sales professionals, and those with a general interest in packaging technologies related to semiconductors.

Seminar Focus

As semiconductor technology continues to adapt to changing market demands, insights into the following topics will be discussed:

• - The use of resin packaging methods which protect semiconductors and are applied in various general-purpose semiconductors.
• - The shift towards larger semiconductor chips needing advanced packaging solutions, inspired by trends in AI applications and integrated circuits.
• - Challenges posed by thermal deformation and the need for innovative protective measures.

The seminar will elucidate both traditional and advanced packaging technologies, sharing the immense transformations happening in the field.

Program Overview

The agenda for the seminar includes:
1. Overview of Resin Packaging Technology: History, types of resin encapsulation processes such as transfer molding, liquid encapsulation, and compression molding.
2. Sealing Material Technology: Composition, design, manufacturing processes, and evaluation methods for such materials used in packaging.
3. Challenges and Solutions in Resin Packaging: Issues during packaging processes, implementation difficulties, and strategies to mitigate them.
4. Trends in Advanced Semiconductor Packaging: Addressing chip areas, AI adaptations, module considerations, and cooperation among different semiconductor chip manufacturers.

About the Speaker

Shigeru Koshibe graduated from Osaka University with a degree in engineering and has decades of expertise in semiconductor packaging materials. He founded iPack, providing technological consulting within the optics and semiconductor sectors. With over 200 seminars and numerous publications, his insights will provide substantial value to attendees.

How to Register

To register for this seminar, please visit the CMC Research seminar site. After registration, attendees will receive a URL for access to the live seminar via email. We strongly encourage participation as this event promises to advance one’s understanding of a critical aspect of modern technology.

For further information, please check our website for other upcoming webinars and publications that cater to the semiconductor and materials technology fields.

Don't miss this chance to enhance your knowledge and network with industry professionals!