#Japan #Tokyo #AI Data Center #Cooling Technology #CMCRE Research

Upcoming Seminar on AI Data Center Cooling Technologies

Hosted by: CMC Research Inc.
Date: February 18, 2026
Time: 10:30 AM - 4:30 PM
Platform: Zoom (with materials provided)

In the age of AI advancements, managing heat generation in data centers has become critical due to rising power consumption and thermal issues. This seminar will delve into cutting-edge cooling technologies specifically designed for AI data centers, preparing attendees to tackle these pressing challenges.

Overview of the Seminar

As AI technologies like ChatGPT and DeepSeek gain prevalence, the corresponding demand for processing power has skyrocketed. The heat generated by AI chips now exceeds 1 kW, making cooling solutions paramount in system design. This seminar will ensure participants gain a comprehensive understanding of the latest cooling strategies, including traditional air and evolving liquid cooling methods, as well as more advanced techniques like immersion and boiling cooling.

Key Learning Outcomes

Attendees will explore:

• - Fundamental heat transfer principles.
• - Heat management in component and PCB design.
• - Design strategies for forced and natural air cooling systems.
• - Effective thermal design methodologies for heat sinks.

Target Audience

The seminar is geared towards professionals involved in:

• - Electronic device design (implementation, mechanical, circuit design, PCB design)
• - Development of heat management devices/materials, and quality assurance sectors.

Seminar Details

• - Facilitator: Naoki Kunimoto, CEO of Thermal Design Lab Inc.
• - General Participation Fee: ¥55,000 (including tax)
• - Mailing List Subscriber Rate: ¥49,500 (including tax)
• - Academic Rate: ¥26,400 (including tax)

Seminar Agenda

The session will include the following topics:
1. Recent Trends in Server Power Consumption
- Insights on server trends across various industries (telecommunication, automotive, consumer electronics).
- Exploring increased heat generation in edge devices due to AI.
2. Essential Thermal Design Knowledge
- Mechanisms of heat transfer and terminology explained at both micro and macro levels.
- Fundamental equations to derive parameters for thermal management.
3. Cooling Strategies for High-Performance AI Servers
- Recommended cooling approaches based on GPU heat output and various server types.
- Addressing heat flow bottlenecks in high-heat semiconductor devices.
4. Cooling Devices and Their Applications
- Evolution of heat sinks and development methods.
- Case studies of heat pipe and vapor chamber technology.
5. Addressing Heat Issues in Data Centers
- Discussion on achieving PUE goals set by the energy authority and cooling technology challenges.
6. Thermal Conductance in Edge Devices
- Heat management techniques specific to smartphones and base stations, focusing on their structural design.
7. Material Selection for Thermal Interface Materials (TIM)
- Overview of TIM types, evaluation methods, and material trends.
8. Future Directions in Heat Management
- Impact of chiplet technology and silicon photonics on future applications.

Registration

To participate, please register through the CMC Research seminar page. A URL for participation will be emailed after registration.

Note: Recording or photography during the seminar is strictly prohibited.

For more details and to sign up, visit: CMCRE Seminar Registration