#Austria #EV Group #St. Florian #EVG40 D2W #Chiplet Integration

EV Group Unveils the EVG®40 D2W for Enhanced Chiplet Integration

In an exciting development for semiconductor manufacturing, EV Group (EVG) has launched the EVG®40 D2W, a cutting-edge die-to-wafer overlay metrology system designed to provide comprehensive measurement capabilities across 300 mm wafers. This innovative system sets a new industry benchmark by delivering 100 percent die overlay measurement with a remarkable throughput up to 15 times higher than the previous EVG®40 NT2 system, significantly enhancing production efficiencies for chipmakers.

Meeting the Rising Demands of Advanced Manufacturing

The new EVG®40 D2W platform is pivotal in the ongoing evolution of semiconductor designs, particularly as demands increase for high-performance devices in sectors such as artificial intelligence (AI), high-performance computing (HPC), and autonomous vehicles. By integrating diverse chiplets of various sizes and materials into a single package, this metrology system addresses the complex requirements posed by modern applications, ensuring optimal placement accuracy and improved production yields.

Key advancements in the EVG®40 D2W include:

• - Full wafer coverage: Achieving rapid feedback for die placement accuracy across nearly 2800 measurement points in just four minutes.
• - High precision: Utilizing advanced algorithms to assess alignment, distortion, and various aspects of die performance, enabling swift corrective actions during production.
• - Flexible integration: This metrology solution can be paired with existing D2W bonding systems, ensuring consistent quality control throughout the manufacturing process.

Why Legacy Systems Fall Short

Traditional overlay metrology systems often falter when tasked with die-to-wafer bonding due to their reliance on obsolete methods that do not align well with the rapid pace of modern semiconductor manufacturing. With insufficient throughput and constrained measurement precision, these legacy systems can lead to errors that compromise yield and overall performance. The EVG40 D2W not only raises the bar for measurement accuracy but also integrates seamlessly into high-volume manufacturing settings, making it an essential tool for semiconductor companies aiming to optimize their processes.

A Game Changer for the Industry

EVG's commitment to innovation is evident through the development of the EVG40 D2W. According to Paul Lindner, executive technology director at EVG, this system is designed specifically for the complexities of die-to-wafer bond integration. The enhancements in measurement speed and accuracy position the EVG40 D2W as the most efficient tool in its class, enabling significant advancements in hybrid bonding processes.

The EVG40 D2W's introduction comes at a time when technology demands for semiconductors are reaching unprecedented levels. With more devices requiring integration across varied functions and characteristics, having a reliable metrology system in place is crucial for ensuring both product quality and manufacturing efficiency.

Upcoming Presence at SEMICON Taiwan

EV Group will showcase the EVG40 D2W at SEMICON Taiwan, taking place from September 8-12. Attendees will have the opportunity to explore how this new platform enhances the production capabilities of modern semiconductor technologies. The EVG team will also host discussions related to innovations in D2W bonding and hybrid integration processes, demonstrating their ongoing commitment to addressing industry challenges and pushing technological boundaries.

With the EVG40 D2W, EV Group reinforces its position as a leader in semiconductor manufacturing solutions by providing technologies that not only meet current industry standards but set new ones, ultimately driving the market forward toward greater efficiencies and innovations.