#United States #Pittsburgh #Thermal Management #AI Chips #NovoLINC

NovoLINC Closes Funding to Transform AI Chip Cooling

NovoLINC, a leading innovator in advanced thermal interface materials (TIMs) tailored for high-performance computing, has recently wrapped up a successful funding round that garnered oversubscribed interest. This significant investment was co-led by Fathom Fund and TDK Ventures, attracting robust participation from existing backers like Foothill Ventures, M Ventures, and Carnegie Mellon University, along with new investor Hitachi Ventures.

The funding aims to accelerate the commercialization of NovoLINC's pioneering technology, which crucially addresses the escalating thermal management challenges posed by the rapid growth in power density of advanced AI and networking chips. As industries transition from air-cooling to liquid cooling systems to manage multi-kilowatt GPUs, CPUs, and ASIC accelerators, NovoLINC’s proprietary nanostructured TIMs have emerged as a vital component. This technology is capable of supporting power densities that exceed 100 W/cm², a feat that conventional TIMs struggle to achieve reliably.

Unprecedented Thermal Performance

NovoLINC boasts a remarkable thermal resistance of just 0.7 mm²•K/W, setting a new industry standard that facilitates over ten times lower interface resistance than traditional materials. This unique construction not only adeptly manages localized heat but also features an adaptive interface designed to cope with dynamic chip warpage during operations. Such capabilities directly target significant reliability challenges associated with next-generation semiconductor packaging.

The advanced performance characteristics, in conjunction with a proprietary continuous manufacturing process, position NovoLINC to provide a scalable and cost-effective solution for widespread use across the computing sector. According to estimations, this leap in thermal efficiency could lead to over a 30% improvement in thermal contact performance between chips and coolant in direct liquid cooling systems. If deployed on a global scale by 2030, systems utilizing NovoLINC technology could significantly reduce annual energy consumption by more than 30 TWh, translating into substantial savings in data center operational costs amounting to billions of dollars.

Proven Commercial Traction

NovoLINC has already demonstrated noteworthy commercial traction with major market players, including hyperscale data centers, AI and networking chip manufacturers, AI server OEMs, and providers of cold plate solutions. The company has also achieved recognition in leading industry initiatives, such as the Open Compute Project (OCP) Startup Member Program and the NVIDIA Inception Program, even being honored as a Top 50 company by the Pittsburgh Technology Council.

The newly acquired capital will support efforts in scaling up manufacturing, enhancing research and development, and strategically developing business initiatives to satisfy soaring customer demand.

Insights from Leadership

Dr. Ning Li, the co-founder and CEO of NovoLINC, expressed enthusiasm about the future, stating, “Our team is working closely with industry partners to fast-track our manufacturing scale-up and commercialize our technology, addressing the burgeoning demands associated with high-power computing and the sustainable operation of AI data centers. This investment underscores our pivotal role in empowering the next wave of AI and high-performance computing.”

Paul Sheng, Managing Partner at Fathom Fund, emphasized the urgency of addressing thermal dissipation challenges, noting, “The innovative material system developed by NovoLINC enables superior thermal dissipation in the Z-direction compared to the best current technologies, while also ensuring production scalability and cost-effectiveness through proven electrochemistry. It serves as a critical foundation for effective liquid cooling solutions.”

Tina Tosukhowong, Investment Director at TDK Ventures, highlighted the pressing need for solutions like those offered by NovoLINC, stating, “With around 40% of a data center's energy consumed on cooling, NovoLINC addresses one of the key technical challenges in the market. Their TIM technology, which provides unparalleled thermal resistance and performance, is essential for enhancing chip cooling and facilitating the industry's shift to liquid cooling solutions.”

Finally, Wolfgang Seibold, Partner and CIO at Hitachi Ventures, remarked on the potential impact of NovoLINC’s innovations, asserting, “We believe that enabling technologies that underpin system architecture will hold the next wave of value in AI infrastructure. By addressing thermal transfer at the material level, NovoLINC enhances performance and efficiency throughout cooling systems.”

About NovoLINC

Founded as a spin-out from Carnegie Mellon University, NovoLINC is at the forefront of developing advanced thermal interface solutions based in Pittsburgh, PA. The company’s unique materials and proprietary manufacturing techniques promise to revolutionize thermal management for high-performance computing, data centers, and power electronics.

With prior seed funding initiatives led by M Ventures, and ongoing support from various programs like the U.S. National Science Foundation, NovoLINC is poised to continue its journey toward transformational impacts in technology.

For further information, visit www.novolinc.com.