#USA #QuickLogic #eFPGA #Chiplet Summit #Santa Clara, California

QuickLogic's Participation at Chiplet Summit 2026

QuickLogic Corporation, a prominent player in the semiconductor industry, is set to participate in the highly anticipated Chiplet Summit 2026. This event, which will be held from February 17 to 19 in Santa Clara, California, promises to be a significant gathering for professionals interested in chiplet architectures, advanced packaging, and heterogeneous integration.

Exhibition and Technical Presentation

At the Chiplet Summit, QuickLogic will exhibit its cutting-edge technology at Booth #416, allowing attendees to explore how its embedded FPGA (eFPGA) IP and chiplet solutions can facilitate flexible and scalable architectures for advanced heterogeneous integration. The company has stood out for its innovative approaches to semiconductor technology, and this event will be no different.

In addition to the exhibition, QuickLogic will also present a technical session titled "Enabling Flexible Heterogeneous Integration with an eFPGA Chiplet on Intel® 18A." This presentation will be delivered by Trey Peterson, Applications Engineer at QuickLogic, during Session E-202 on Thursday, February 19, from 3:00 p.m. to 4:20 p.m. The session aims to delve into the capabilities of eFPGA chiplets, focusing on their ability to enhance post-silicon adaptability and extend platform flexibility in advanced process nodes.

Event Schedule and Accessibility

The exhibition will run on the following schedule:

• - Wednesday, February 18: 12:30 p.m. – 8:00 p.m.
• - Thursday, February 19: 12:00 p.m. – 3:00 p.m.

Attendees will have the opportunity to engage with QuickLogic's representatives, ask questions about their technologies, and gain insights into the future of chiplet solutions.

About QuickLogic Corporation

QuickLogic is a fabless semiconductor company that is at the forefront of developing eFPGA Hard IP, discrete FPGAs, and endpoint AI solutions. The company’s unique combination of advanced technology and open-source tools positions it strongly to deliver customizable and low-power solutions across multiple sectors, including aerospace and defense, industrial applications, computing, and consumer electronics.

Conclusion

With the growing importance of chiplets in the semiconductor landscape, QuickLogic's participation in the Chiplet Summit 2026 highlights its commitment to innovation and adaptability in the face of evolving market demands. The event not only serves as a platform for QuickLogic to showcase its technologies but also offers a critical insight into the future of integrated semiconductor solutions.