Exploring E&R's Latest Innovations in Laser and Plasma Technologies at SEMICON Taiwan 2025

E&R Engineering Highlights Laser and Plasma Technologies at SEMICON Taiwan 2025

As artificial intelligence (AI), high-performance computing (HPC), and 5G technologies continue to drive innovations in the semiconductor sector, advanced packaging has emerged as a crucial area of focus. According to the Yole Group, the market for advanced packaging is expected to surpass USD 50 billion by 2025, with fan-out panel-level packaging (FOPLP) anticipated to grow over 15% each year.

Showcasing Innovations

At the upcoming SEMICON Taiwan 2025, E&R Engineering Corp. (TPE 8027) will feature its latest advancements in laser and plasma solutions tailored for sophisticated packaging requirements. These innovations cover FOPLP, Through-Silicon Via (TSV), Through-Glass Via (TGV), and plasma dicing, all of which facilitate high input/output density management, warpage control, and Ultra-fine feature processing.

FOPLP Solutions

E&R Engineering presents a comprehensive range of equipment, including laser marking, dicing, plasma cleaning, laser debonding, and ABF (Ajinomoto Build-up Film) drilling, capable of handling panels up to a sizeable 700×700 mm. With exceptional precision control, their systems ensure reliable productivity while efficiently processing substrates that exhibit warpage of up to 16 mm. This capability makes them a preferred choice for companies seeking to streamline and enhance their packaging processes in line with industry demands.

TSV Applications

With the increasing adoption of 3D packaging and advanced memory technologies, TSV has become a quintessential component for achieving high-density integration. E&R offers innovative via drilling, cleaning, and debonding solutions that leverage both laser and plasma technologies. These tools enable precise via profiles, minimal defects, and durable interconnects across various wafer sizes and materials, ensuring optimal performance in cutting-edge semiconductor applications.

Glass Substrate Innovations

In the rapidly developing segment of glass core substrates, E&R's laser modifications have achieved a remarkable > 0.9 via circularity, 101 aspect ratios, and an extraordinary drilling speed of 1,500 vias per second. Their solutions cater to CoPoS (Chip-on-Package-on-Substrate) and ABF substrate applications, thereby promoting high-performance and high-yield manufacturing outcomes. In collaboration with E-core partners, E&R will also be demonstrating a complete metallization-enabled glass substrate process flow, showcasing the effectiveness of their innovations.

Comprehensive Equipment Support

All equipment offered by E&R Engineering is designed, manufactured, and validated within Taiwan, utilizing components sourced from leading suppliers in the U.S. and Europe. With over 500 units having been shipped globally, E&R's solutions have found prominent adoption in FCBGA (Flip Chip Ball Grid Array), FCCSP (Fan-Out Chip Scale Package), and wafer-level packaging used by major OSATs (Outsourced Semiconductor Assembly and Test) and IDMs (Integrated Device Manufacturers). Furthermore, they have expanded their Flip Chip BGA portfolio to include Pre-Flip Chip Die Bond Plasma Cleaning, Pre-Molding/Underfill Plasma Cleaning, and Laser Marking for traceability.

In keeping pace with technological advancements, E&R recently introduced a fully automated, high-power burn-in solution that supports testing environments of up to 3,000W.

Invitation to Industry Partners

E&R Engineering invites all industry partners to join them at SEMICON Taiwan 2025 to explore the next generation of advanced packaging and dicing technologies. The event offers a unique platform for professionals to connect and share insights into the future trajectory of semiconductor innovations.

Event Details:
Venue: Taipei Nangang Exhibition Center, Hall 1
Booth: 4F, #N0968
Dates: September 10–12, 2025
Website: https://en.enr.com.tw/

Explore the forefront of semiconductor packaging solutions with E&R Engineering as they lead the charge into a new era of technology.