#Germany #Munich #Silicon Line #MSDL #EverProX

Silicon Line® Unveils Revolutionary MSDL™ Chipset

On September 3, 2026, EverProX Technologies Munich GmbH announced a significant advancement in optical and electrical interconnection technology with the launch of its new low-power chipset, the MSDL™ (MIPI Serial Data Link). This innovative product aims to enhance MIPI D-PHY connectivity, reaching data rates of 20 Gbit/s over multiple tens of meters, revolutionizing how high-speed data is transmitted in various applications including medical imaging, industrial robotics, and defense systems.

Addressing the Bandwidth Demand

The demand for higher bandwidth is rapidly increasing, driven by high-resolution multi-camera systems and high frame rate displays. Traditional copper cabling struggles with limitations such as distance constraints and electromagnetic interference (EMI), which hampers performance and reliability. The MSDL™ 20G chipset, featuring the SL8582x serializer and SL8581x deserializer, addresses these challenges by facilitating the grouping of multiple video streams over optical fibers or differential copper pairs. This not only extends the range of connections significantly but also eliminates bulky shielded cable bundles, leading to a more streamlined installation.

Minimal Power Consumption

One of the key benefits of the MSDL™ chipset is its remarkably low power consumption, ensuring that devices maintain efficiency without sacrificing performance. The total power usage for the SerDes is well under 100 mW per 10 Gbps connection, making it an excellent choice for applications requiring energy efficiency, including wearable technology and battery-powered devices. For instance, the optical mode of the serializer operates at just 17 mW, while the deserializer consumes about 54 mW under typical conditions.

Enhanced Use Cases

The versatility of the MSDL™ chipset opens up applications in several emerging fields:

• - Augmented and Virtual Reality: Enhances connectivity, allowing for lighter and more flexible setups, increasing mobility for users.
• - Medical Endoscopy: Provides support for 4K/8K imaging with minimal heat generation and compact optical connectivity.
• - Industrial Robotics and Vision Systems: Ensures reliable high-speed vision connectivity that is resistant to EMI, important in challenging industrial environments.
• - Defense and Drones: Offers lightweight, low-power multicamera connectivity that reduces cable weight and prolongs battery life.

Technical Highlights

• - Multi-Camera Aggregation: Supports up to two simultaneous transmissions of high-speed streams from either single or stereo camera systems.
• - Flexible Connectivity Options: Integrates VCSEL drivers and TIA amplifiers to provide high-performance optical links spanning over several tens of meters, along with supporting copper connections up to 2 meters.
• - Integrated Bidirectional SerDes: Manages various signals including I²C, GPIO, and digital audio, simplifying system architecture and reducing component count.

Future Availability

The MSDL™ 20G chipsets (SL8582x and SL8581x) are currently available for sampling to early access customers, in bare die form or as compact µBGA-78 packages sized 4 x 4 mm. Evaluation kits (EVK) are also available for customers seeking to validate their connections.

EverProX provides a comprehensive assembly solution, allowing customers to transition smoothly from circuit design to mass production.

For more information, visit Silicon Line’s website or contact their team for inquiries.

About EverProX Technologies

Founded in Munich, Germany, EverProX Technologies operates under the Silicon Line® brand, recognized as a leader in the development of low-power IC solutions for high-speed video and data transmission. The company focuses on advancing technologies that cater to various industries including consumer electronics, medical technology, and high-end industrial applications.

For media inquiries, please contact Emre Oralli, Product Marketing Manager, at +49 151 20620735.