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Molex Expands AirBorn SInergy Modular Connectors

Molex, a renowned leader in the electronics industry, is making waves with its latest enhancement to the AirBorn SInergy Modular High-Speed Hybrid Connectors. This expansion introduces new high-power modules designed to deliver an impressive 25.0A of power within a single standard module bay. This groundbreaking advancement represents a staggering 12.5x increase in power delivery capability, making it ideal for a variety of compact systems that require robust performance in demanding environments.

Addressing High-Performance Demands

The new modules are set to redefine how connectors are perceived in the aerospace and defense sectors. According to Billy Rhea, group product director for Aerospace and Defense Solutions at Molex, the modern evolution of aerospace technology necessitates superior power delivery solutions. With the integration of high-power, high-speed data, and RF contacts, the AirBorn SInergy platform offers seamless and flexible connectivity essential for mission-critical applications.

Design engineers will find these high-power modules advantageous in addressing the growing need for power in various applications, including aircraft launch systems, advanced radar systems, avionics, satellites, and military vehicles. The combination of high-density signal contacts capable of supporting data rates up to 25Gbps, alongside RF contacts reaching up to 40 GHz, makes these modular connectors exceptionally suitable for space-constrained and geometrically intricate designs.

Configuration Flexibility

A standout feature of the new AirBorn SInergy modules is their configuration flexibility. Engineers can configure up to five bays of interchangeable connectors, allowing the combination of different contact types that meet specific application demands. Unlike traditional hybrid connectors, which often come with fixed layouts, the SInergy platform offers true position-by-position configuration flexibility. This means that designers can place the exact contact type where it is most needed, facilitating easier adaptation within their existing systems.

The connector's compact footprint, roughly the size of a U.S. quarter, combined with versatile mounting options ensures optimal mechanical alignment and security during mating. This innovation aims to alleviate the common struggles associated with dense printed circuit board (PCB) setups, where engineers have typically had to source multiple connectors from various suppliers. The SInergy connector simplifies this process by offering an integrated, customizable platform, thereby reducing the bill of materials and streamlining supply chain processes.

Robust Performance in Extreme Conditions

For applications that operate under extreme conditions, reliability is paramount. The AirBorn SInergy connectors are built on a legacy of innovation, following the celebrated AirBorn M Series and N Series connectors. These new modules are engineered to endure extreme temperatures, vibrations, shocks, and moisture, ensuring compliance with MIL-DTL-83513 specifications to maintain rugged performance in the field.

Furthermore, the new high-power contacts are detailed under the MIL-DTL-39029 standard, enabling simplified design and effective power delivery. The elevated thermal proficiency of these modules is evident with a strict 30°C temperature rise (T-Rise) baseline over ambient. This engineering feat reassures users that the modules can handle specialized applications where heat dissipation options are severely restricted.

A Survey of Engineers' Needs

Molex conducted a survey as part of its report on the State of Design Engineering in Aerospace and Defense, revealing that 52% of engineers ranked escalating power needs as their primary concern. Other vital technology innovations highlighted by participants include advancements in power distribution, on-board power management, high-speed data transfer, and electronic defense technologies.

The new addition of high-power modules to the AirBorn SInergy connector portfolio comes as a direct response to this feedback, emphasizing Molex’s commitment to customer-centric innovation. Collaborations with global OEMs, prime contractors, and Tier 1 suppliers have provided insights to develop modular solutions that adeptly support power, signal, or RF functionality.

Conclusion

In summary, Molex's ongoing commitment to connectivity innovation is clearly displayed in the advancements of the AirBorn SInergy Modular High-Speed Hybrid Connectors. By introducing new high-power modules, the company is not only enhancing power delivery capabilities but also simplifying system designs in demanding applications. This innovation solidifies Molex's position as a leader in the electronics industry, dedicated to creating connectivity solutions that empower next-generation technology across multiple sectors.