#Japan #Tokyo #Semiconductor #Achilles Corp #Glass Substrate

Achilles Corporation's Innovative Coating Technology

Achilles Corporation, headquartered in Shinjuku, Tokyo, has made a significant breakthrough in semiconductor manufacturing technologies. The company has developed an advanced coating method utilizing polypyrrole plating, enabling the formation of high-adhesion coating films on glass substrates with through-holes. This innovative technology will be showcased at SEMICON Japan 2025, taking place from December 17th at Tokyo Big Sight.

The Challenge of High-Adhesion Coating on Glass

The semiconductor industry is increasingly turning to glass substrates as a viable alternative for packaging due to their unique properties. However, traditionally, achieving high adhesion on glass typically requires temperatures exceeding 300°C, making the process challenging and energy-intensive. Achilles's new polypyrrole plating technology addresses these challenges by allowing efficient coating under low-temperature, ambient pressure conditions, thereby forming a robust adhesion layer on glass substrates.

This is particularly crucial for next-generation semiconductor devices, which demand higher density and miniaturization. The introduction of high-adhesion coatings on glass substrates with through-holes supports advanced applications in semiconductor packaging, essential for evolving technology frontiers.

Development Process and Future Collaborations

Achilles's dedicated research team has meticulously investigated various factors, such as coating viscosity and application methods, to enhance the adhesion properties when plating through-holes. The increasing demand from semiconductor manufacturers has driven the development of this technology, making it a key component in the advancement of high-density semiconductor packaging solutions.

Looking ahead, Achilles plans to collaborate further with semiconductor companies to refine related techniques such as fine wiring creation and mass production capabilities. This collaborative approach aims to expand the use of this technology within the semiconductor manufacturing sector, catering to the industry's need for innovation.

Showcase at SEMICON Japan 2025

During SEMICON Japan 2025, Achilles will exhibit its cutting-edge polypyrrole plating technology at booth W2625. Attendees will gain insights into the new coating method and view sample products demonstrating its effectiveness. This event represents an important opportunity for the company to engage with stakeholders, showcase its technological advancements, and strengthen its position within the semiconductor ecosystem.

Expanding the Applications of Polypyrrole Plating

Achilles has invested over a decade in perfecting the polypyrrole plating method, which relies on a unique nano-dispersed polypyrrole solution. Key features of this technology include:
1. Coating is selectively deposited only where the nano-dispersed polypyrrole is applied.
2. High adhesion on various substrates, expanding application versatility.
3. Environmentally friendly, eliminating the need for etching processes, which reduces ecological impact.

The polypyrrole plating technology has found substantial utilization in electromagnetic shielding for devices like smartphones, contributing to products becoming thinner and lighter. The company has successfully secured around 50 patents related to this innovative method, underscoring its significance and potential in the market.

Conclusion

As the demand for smaller, more efficient semiconductor solutions continues to grow, Achilles Corporation is poised to lead the charge with its groundbreaking coating technologies. The unveiling of this new high-adhesion coating method marks a pivotal step forward in the industry, promising to elevate the standard for semiconductor manufacturing and packaging.

For further details, inquiries can be directed to the IR/PR Department at Achilles Corporation: Contact Information

Achilles Corporation 169-8885 Tokyo, Shinjuku, Kitashinjuku 2-21-1, Shinjuku Front Tower Website