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RiseLink at CES® 2026: Shaping the Future with Ultra-Low-Power AI and Wi-Fi SoCs

At the forefront of innovation, RiseLink is making waves at CES® 2026 with its ultra-low-power Wi-Fi and AIoT system-on-chips (SoCs). As a key player in the tech landscape, the company is demonstrating how its cutting-edge technologies are revolutionizing smart devices, making them more functional and efficient than ever before.

During the event, RiseLink's CEO, Dr. Pengfei Zhang, will join prominent figures from Amazon, Bosch, Ecobee, and EY on an official panel dedicated to smart home advancements. The discussion, titled "The Latest in Smart Devices and Smart Home Integration," promises to deliver insights into the future of home automation, showcasing how leading companies interact and compete in this rapidly evolving market. You can find more information about this session through the official CES program.

Dr. Zhang emphasized the importance of integrating artificial intelligence directly into devices. He stated, "RiseLink focuses on enabling edge AI through ultra-low-power, cost-effective system-on-chips that allow smart devices to scale reliably from prototype to production." This highlights the company's commitment to not only enhance model capabilities but also to ensure efficiency and seamless integration into everyday life.

Among the exciting highlights at CES is the unveiling of ChooChoo, an innovative AI-powered interactive reading toy developed using RiseLink's technology. This product demonstrates how conversational AI can be effectively deployed on-device, making it ready for consumers. Dr. Diana Zhu, RiseLink’s Head of U.S. and creator of ChooChoo, noted: "ChooChoo brings research-driven interaction to life on the edge." Live demonstrations of this interactive toy will take place at the RiseLink booth (Venetian Expo Hall A–D, Booth 53117), allowing attendees to experience firsthand the capabilities of AI in consumer products.

In addition to the panel discussions and product showcases, RiseLink will host a special event titled "The Blueprint for Physical AI: AI-Native Hardware Mixer @ CES 2026." This invitation-only gathering will take place on January 8, 2026, and aims to facilitate networking among founders, product leaders, chipmakers, and system architects focused on developing AI-native smart devices. This eclectic mixer is a fantastic opportunity for those deeply invested in the technological space to share insights and strategies on scaling edge AI from conception to production.

Attendees can visit RiseLink at their booth during CES 2026, where the team will present their latest Wi-Fi MCU and AIoT platforms. These platforms are designed to deliver superior RF performance and deep system integration for various applications, including smart home devices, AI-enabled consumer goods, and other emerging intelligent solutions. This sets a new industry standard, showcasing high performance alongside ultra-low power consumption.

As CES 2026 unfolds, RiseLink is poised to leave a lasting impression on the tech community and consumers alike, further establishing its position as an innovator in the AI and IoT sectors. For those interested in scheduling meetings with the RiseLink team during CES, details are available on their website.

About RiseLink

RiseLink serves as the international headquarters and innovation hub for Beken Corporation (SSE 603068), a fabless semiconductor company that excels in wireless communication and AIoT solutions. Focused on delivering high-performance, energy-efficient Wi-Fi and edge AI technologies, RiseLink is committed to enhancing smart home devices and AI-enabled applications worldwide.