#None #Semiconductor #CMC Research #packaging technology

Upcoming Seminar on Semiconductor Packaging Technology

CMC Research is set to host a critically important live seminar on semiconductor packaging technology fundamentals, scheduled for July 2, 2026, from 1:30 PM to 4:30 PM JST. This online event will be conducted via Zoom, and participants will receive accompanying materials to enhance their learning experience.

Lead Speaker: The seminar will be led by Akira Ishibe, the President and CEO of ISTL. With extensive experience in semiconductor process technology, his insights into industry trends will be invaluable.

Seminar Theme

The focus of this seminar is "Fundamentals of Semiconductor Packaging Technology". It will cover various essential aspects, including:

• - The evolution of package forms
• - Manufacturing processes and the equipment and materials used
• - Latest trends impacting the semiconductor landscape

Understanding advanced packaging technologies is crucial as we near the limits of Moore's Law, which has spurred progression in heterogeneous integration, chiplets, and photonic-electronic convergence.

Learning Outcomes

Participants will walk away with:

• - Insights into the historical evolution of semiconductor packaging technology
• - Knowledge about the manufacturing processes, materials, and machinery involved in semiconductor packaging
• - An understanding of cutting-edge packaging technologies and their future directions

Target Audience

This seminar will benefit:

• - Engineers seeking foundational knowledge in semiconductor packaging technology
• - Sales and marketing professionals involved in the semiconductor industry
• - Newcomers to the semiconductor market
• - Anyone interested in the latest trends in advanced packaging technology

The cost for registration is as follows:

• - General Admission: 44,000 JPY (tax included)
• - Newsletter Subscribers: 39,600 JPY (tax included)
• - Academic Rate: 26,400 JPY (tax included)

Seminar Schedule

The program includes several key sessions divided by breaks, covering:
1. The Role of Semiconductor Packaging
- Discussion on front-end and back-end processes
- Historical evolution of substrate mounting methods
2. Evolution and Elemental Technologies in Packaging
- Packaging evolution in PCs and mobile phones
- Comprehensive overview of package forms, including DIP, QFP, TCP, BGA, and WLCSP
3. Latest Packaging Techniques and Future Directions
- Factors necessitating advanced packaging due to limitations of Moore's Law
- A look into various System-in-Package (SiP) frameworks and CoWoS technologies
4. Speaker Profile
- Akira Ishibe (President, ISTL): With a PhD in Engineering and a career spanning several major companies, Ishibe brings a wealth of experience in semiconductor manufacturing and technology.

Registration Details

To register, please visit the seminar page on CMC Research's website. A URL for viewing will be sent via email following your registration. For any related questions or concerns, do not hesitate to reach out.

Conclusion

Don't miss this opportunity to gain a nuanced perspective on the critical area of semiconductor packaging technology. Reserve your spot for this informative seminar and ensure you're well-equipped for future innovations in the industry.