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Upcoming Seminar on Semiconductor Packaging Technology

Overview

On April 24, 2026, CMC Research is hosting a live seminar titled "Fundamentals of Semiconductor Packaging Technology". This informative event will take place from 1:30 PM to 4:30 PM JST via Zoom. The seminar aims to unravel the evolution of packaging forms, manufacturing processes, the devices and materials used, and the latest trends in this rapidly evolving field.

Seminar Details

• - Date and Time: April 24, 2026 (Friday) from 1:30 PM to 4:30 PM JST
• - Mode: Live Zoom session with provided materials
• - Instructor: Akira Isobe, President of ISTL Co., Ltd.

Purpose of the Seminar

In recent years, advancements in semiconductor packaging technology have been remarkable, focusing on innovations such as chiplets, heterogeneous integration, and photonic-electronic fusion. While device performance improvements have traditionally stemmed from finer processes, limitations in miniaturization have made it necessary for packaging technology to evolve. This seminar will clarify the development of packaging technology and its fundamental elements, making it accessible even for beginners.

Learning Objectives

Participants in this seminar will gain insights into:
1. The historical evolution of semiconductor packaging technologies and their underlying factors.
2. The manufacturing processes, materials, and devices used in semiconductor packaging.
3. Cutting-edge packaging technologies and their anticipated future directions.

Target Audience

This seminar is designed for engineers, sales representatives, and marketing professionals eager to learn the basics of semiconductor packaging technology.

Registration Fee

• - General Admission: ¥44,000 (tax included)
• - Newsletter Subscribers: ¥39,600 (tax included)
• - Academic Rate: ¥26,400 (tax included)

How to Register

Interested attendees can register through the CMC Research seminar site. After registration, a URL for viewing will be sent via email. Detailed registration information can be found here.

Seminar Program

1. The Role of Semiconductor Packaging
- The interrelation between front-end and back-end processes
- Historical transformations in substrate mounting methods
- Key requirements for semiconductor packaging

2. Evolution of Semiconductor Packaging and Fundamental Technologies
- The evolution of PC and mobile phone packaging forms
- STRJ package roadmap
- Explanation of various packaging types: DIP, QFP, TCP, BGA, QFP, WLCSP, etc.
- Essential technologies for packaging manufacturing including backside grinding, dicing, die bonding, wire bonding, molding, and bump technology.

3. Latest Packaging Technologies and Future Directions
- Background on the need for advanced packaging amid Moore's Law limits
- Types of System in Package (SiP)
- Overview of FOWLP and CoWoS
- Insights into chiplet, EMIB technology, and photonic-electronic fusion packaging
- Future directions in packaging technology

Speaker Biography

Akira Isobe serves as the President of ISTL Co., Ltd. He has an extensive background in semiconductor process technologies, including multi-layer wiring processes and chemical-mechanical polishing.

Upcoming Related Webinars

The seminar will also inform about various upcoming webinars, including:

• - Energy-saving industrial-scale separation processes
• - Competitive challenges in non-automotive battery sectors
• - Understanding silicon chemical products
• - AI integration in physical environments
• - Advances in lithium-ion batteries

For more details, join us for this exciting seminar and enhance your understanding of semiconductor packaging technologies. Don't miss out on this opportunity to engage with industry leaders and gain valuable insights that could elevate your professional knowledge.