#USA #Sunnyvale #Semiconductor #E&R Engineering #ISIG

E&R Engineering Showcases Innovations at ISIG 2026

E&R Engineering Corp. (8027.TW), a prominent innovator in semiconductor processing equipment, is gearing up to present its latest advancements in packaging technology at the International Semiconductor Industry Group (ISIG) Symposium on April 20-21, 2026. The event will be held at the Plug and Play Tech Center in Sunnyvale, California.

Focus on Advanced Packaging and Co-Packaged Optics

With the recent establishment of its second North American site in Hillsboro, Oregon, E&R Engineering is increasing its focus on the Silicon Valley ecosystem. The company’s participation in ISIG reiterates its dedication to propelling the semiconductor industry's rapid advancements towards cutting-edge packaging techniques, co-packaged optics (CPO), fan-out panel level packaging (FOPLP), and Through-Glass Via (TGV) technologies.

During the ISIG 2026 event, E&R Engineering plans to unveil several core technologies that cater to high-performance computing and artificial intelligence applications. Among the notable highlights:

• - Advanced Packaging and CPO: Specializing in plasma cleaning and laser technologies that enhance wide-bandwidth optical interconnections and heterogeneous integration.
• - Fan-Out Panel Level Packaging (FOPLP): E&R's complete solution supports large panel processes, including laser marking, dicing, descum, plasma cleaning, and post-dicing debonding, with warpage control up to 16 mm. This process is further refined through laser debonding and dry plasma etching for glass substrate separation.
• - Innovative TGV: Featuring high-precision laser capabilities and processing tailored for glass substrates, enabling the next generation of high-density interconnections.
• - Automation Integration Service (AIS): A comprehensive “design-to-implementation” model that integrates multiple process modules into unified and customized systems. The AIS has already attracted significant orders in North America and is expected to be a notable revenue driver through 2027.

Continued Expansion and Localized Support

E&R Engineering's ongoing expansion in the United States aims to enhance local support and global integration. With service centers established in Phoenix, Arizona, and the Portland region in Oregon, the company is committed to providing quicker, localized assistance. This regional expansion not only boosts service efficiency and capacity—extending order visibility through 2027—but also bridges the expertise between Taiwanese technology and the American supply chain, simplifying the transition from equipment installation to high-volume production.

Event Details

• - Date: April 20-21, 2026 (Monday-Tuesday)
• - Location: Plug and Play Tech Center
• - Address: 440 N Wolfe Rd, Sunnyvale, CA 94085

For more information, visit E&R Engineering's official site. Founded in 1988, E&R Engineering Corp. specializes in R&D and manufacturing of processing equipment for semiconductor industries, flexible printed circuit boards, and LEDs. With significant strengths in laser applications, plasma cleaning, and precision automation, E&R serves as a strategic partner to global industry leaders.