#USA #Fremont #SkyWater #YES RapidCure #Deca Technologies

YES RapidCure Systems Chosen by SkyWater Technology

In a significant step forward for semiconductor packaging, Yield Engineering Systems, Inc. (YES) has announced that its YES RapidCure systems have been selected by SkyWater Technology (NASDAQ: SKYT). This partnership focuses on the advanced technology of fan-out wafer-level packaging (FOWLP) using a licensed process developed by Deca Technologies.

The integration of YES's RapidCure systems is poised to enhance SkyWater’s capabilities in the semiconductor industry, particularly as it moves towards the production of the M-Series™ technology in collaboration with Deca. This new approach addresses the industry's need for reduced line width and spacing in packaging, which in turn accelerates the development of new polymer materials designed for low-temperature curing.

The YES RapidCure technology employs a unique combination of direct thermal exposure and ultraviolet (UV) light. This innovative method drastically shortens the processing cycle time, allowing for the optimization of budgets related to the thermal properties of organic and inorganic thin films utilized in various semiconductor applications – from front-end processing to packaging and display technology.

Advantages of YES RapidCure

The RapidCure process involves an initial UV pre-treatment for preliminary crosslinking of the polymers, followed by a precisely controlled thermal curing stage. This method not only enhances performance metrics compared to conventional curing methods but also offers dielectric properties that are comparable or superior. Bassel Haddad, Senior Vice President and GM of Advanced Packaging at SkyWater, expressed enthusiasm over the RapidCure technology, noting its essential role in expediting curing processes and, consequently, offering faster prototyping services and improved reliability.

Rezwan Lateef, President of YES, emphasized the importance of this selection by SkyWater. He stated that the Deca RapidCure technology expands the capabilities of YES's packaging solutions, providing them with a broader range of advanced applications. These include low-temperature polymer curing, filler baking, adhesive curing, as well as gas removal and curing for low-K films, addressing varied fan-out distribution processes.

Tim Olson, founder and CEO of Deca, remarked on the groundbreaking advancement that RapidCure represents for the semiconductor sector. He highlighted how it reduces the standard curing time of six hours to less than 20 minutes, thus significantly accelerating both the development and manufacturing processes for high-density heterogeneous integration devices, laying the foundation for future chiplet-based systems.

About YES

Yield Engineering Systems stands out as a premier supplier of differentiated technologies necessary for materials and interface engineering across a multitude of applications and markets. Their client base includes key players pushing the envelope in advanced packaging for artificial intelligence (AI), high-performance computing (HPC), memory systems, and life sciences.

YES specializes in high-volume production of advanced semiconductor packaging solutions for wafers and glass panels, offering state-of-the-art equipment such as vacuum curing tools, coating and annealing equipment, fluxless reflow tools, cavity and via etching tools, and electroless deposition for enhanced semiconductor manufacturing. Based in Fremont, California, YES is rapidly expanding its global footprint, making significant strides in the semiconductor industry.

For further details, feel free to visit YES.tech.