#USA #San Jose #InPsytech #UCIe 3.0 #Chiplet Ecosystem

InPsytech's Latest Innovations at OCP 2025

In the ever-evolving world of technology, advancements continue to push the boundaries of what's possible. At the OCP Global Summit 2025, taking place from October 13-16 in San Jose, California, InPsytech, a notable subsidiary of Egis Technology, will showcase its cutting-edge 3nm UCIe 3.0 technology. This presentation emphasizes InPsytech's commitment to revolutionizing the chiplet ecosystem and aims to accelerate innovation in semiconductor design.

The Significance of 3nm UCIe Technology

InPsytech has established its reputation by focusing on high-speed and low-power interface intellectual property (IP) solutions. At the summit, the company will introduce its latest 3nm UCIe high-speed interface technology demo, proudly boasting compatibility with the latest UCIe 3.0 standard. This innovation not only showcases ultra-high-speed performance but also supports 3D packaging integration — a vital function in modern chip design.

The company's UCIe portfolio extends support for process nodes from 22nm down to 2nm, optimized for production at the 3nm level. This technology promises data transfer rates reaching up to 64 GT/s, significantly enhancing chip-to-chip interconnect efficiency. By adopting this technology, businesses can benefit from high-efficiency performance that is crucial for advanced semiconductor applications.

Collaborations Driving Innovation

InPsytech's collaboration with Alcor Micro Corp. is another highlight, as both firms work together to enhance the Arm Chiplet Ecosystem. At OCP 2025, visitors can expect to see Alcor Micro's latest Arm-based CPU platform, Mobius100, which integrates the UCIe technology for efficient die-to-die interconnects. This collaboration showcases the joint commitment to advancing heterogeneous computing and innovative chiplet design.

David Hsu, COO of InPsytech, expressed pride in this partnership and emphasized the potential of UCIe technology in influencing the Arm Chiplet ecosystem. He stated, "We have strong confidence in the future of UCIe within the Arm Chiplet ecosystem and believe that InPsytech's UCIe technology will accelerate Chiplet adoption, bringing new innovations and breakthroughs to the global semiconductor industry."

Exhibition Highlights

Attendees at the OCP Global Summit can look forward to:

• - Event: OCP Global Summit 2025
• - Date: October 13-16, 2025
• - Location: San Jose Convention Center, California, USA
• - Exhibit Zone: Innovation Village Zone
• - Showcase: Demonstration of 3nm UCIe 3.0 (with 3D Package Support)
• - Collaboration: Featuring Alcor Micro Corp.

The event promises to be a pivotal moment in the semiconductor industry as it showcases the culmination of collaborative efforts in technology development, notably in the realm of chiplets and their integration into the broader computing landscape.

As companies like InPsytech continue to innovate, the implications for the semiconductor market are vast, paving the way for improved performance and new possibilities in various applications ranging from AI to high-performance computing and beyond.

In conclusion, the introduction of 3nm UCIe 3.0 technology at OCP 2025 not only highlights InPsytech's advancements but also sets the stage for the evolution of the chiplet ecosystem, marking an exciting chapter in the semiconductor industry's future.