Baya Systems to Present Innovative Insights on Chiplet Integration and AI at DAC 2025

Baya Systems to Showcase Expertise at DAC 2025



Baya Systems, a prominent player in high-performance semiconductor technologies, is set to participate in the upcoming Design Automation Conference (DAC) on June 24, 2025. The company will present valuable insights on chiplet integration and artificial intelligence (AI) scalability, alongside other leading industry experts.

Innovations in Chiplet Design


Baya Systems will join the EE Times Chiplet Pavilion, where key executives will participate in discussions focused on the burgeoning chiplet economy. This innovative direction in semiconductor design leverages modular architectures, enabling flexibility and scalability for next-generation AI applications. As demands for computational power and data handling grow exponentially, chiplet technology presents a pathway forward.

Featured Sessions


The DAC features two significant sessions led by Baya Systems' experts that promise to enlighten attendees about the intricacies of modern semiconductor design:

1. Developing the Chiplet Economy - A panel discussion featuring Chief Commercial Officer Nandan Nayampally. This session aims to investigate the commercial readiness of chiplets and the existing hurdles for their widespread adoption. Topics include the necessity for standardized interfaces and integration complexities, with discussions on collaborative efforts required among foundries, IP providers, and tool vendors. By addressing essential factors like pre-validation and supply chain interoperability, this panel will provide a nuanced understanding of how to unlock the potential of multi-die systems.

2. Unleashing Scale Through Chiplets – From Concept to Deployment - Presented by CEO and founder Dr. Sailesh Kumar. This session will delve into how chiplets can structure designs that effectively respond to rising demands for computational capabilities driven by AI. Attendees can expect a comprehensive look at design principles, architectural frameworks, and data management essential for developing advanced edge and cloud systems. Real-world examples of how Baya's chiplet-ready intellectual property is already influencing the market will further elucidate the discussion.

Why Chiplets Matter


As AI technologies evolve, a crucial challenge has emerged concerning existing architectural models. Traditional designs are encountering significant barriers related to power consumption, data transportation, and overall cost, which hampers development time. Chiplet designs offer a promising solution; they facilitate a mix of high-performance and standard components that can drastically accelerate system capabilities without compromising efficiency.

With products already implemented by numerous clients, Baya Systems' insights during DAC 2025 are geared to position chiplet technology as a standard in future semiconductor developments. Collaboration among industry players is vital for overcoming obstacles and enabling the broad acceptance of modular designs.

Event Details


The DAC 2025 takes place at the Moscone Center West, located at 800 Howard Street, San Francisco, CA 94103. Baya Systems encourages interested stakeholders to visit their booth 2430 in West Hall Level Two, and join the enlightening discussions scheduled for:
  • - 200–255 PM PDT – Developing the Chiplet Economy
  • - 300–320 PM PDT – Unleashing Scale Through Chiplets

Baya Systems’ participation not only highlights its innovation but also fosters a call to action for forming collaborative partnerships that can drive the chiplet economy forward, enhancing the scalability of AI solutions in a competitive landscape. For media inquiries, contact Crackle PR at 510-565-5655 or via email at [email redacted].

Join Baya Systems at DAC 2025 to explore future possibilities in semiconductor technology and AI scalability.

Topics Consumer Technology)

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