Advanced Substrate Technology for Tomorrow's Communication
In the rapidly evolving landscape of digital communication, innovative substrate materials and processes play a vital role in supporting the next generation of transmission technologies like 5G and beyond. A seminar titled "Trends in Advanced Substrate Development Applied to Next-Gen High-Speed Communications" will be held on May 14, 2025, from 1:30 PM to 4:30 PM. The event will be conducted via Zoom, featuring Hirofumi Matsumoto, CEO of FlexLink Technology, as the keynote speaker.
The seminar will cover a range of topics central to cutting-edge substrate technologies, exploring essential materials such as polymer optical waveguides, ultra-high frequency substrates, metamaterial substrates, advanced semiconductor packaging (PKG), power semiconductors, and automotive sensor modules. Participants can expect a comprehensive overview of the current advancements and methodologies being deployed to enhance communication systems in our increasingly connected world.
Seminar Overview
The importance of substrate materials and their development processes has become critical as 5G and 6G technologies evolve. This seminar aims to delve deeply into the specifics of material development and manufacturing technology, highlighting innovations that are setting the groundwork for future communication networks.
Key Topics
1. Polymer Optical Waveguide Technology Applied in APN
- What is APN (All Photonics Network)?
- Benchmarks for POW technology
- Manufacturing methods for optical waveguide-integrated substrates (POW + FPC)
2. Development of Ultra-High Frequency Substrate Materials
- Challenges in high-frequency material development
- Mechanisms of dielectric and conductor loss and strategies for reduction
- Parameters and measurement methods for high-frequency materials
3. Metamaterials in 5G/6G Devices
- Introduction to metamaterials
- Applications of metamaterial antennas in 5G/6G communication
- Metasurface applications: millimeter wave lenses and reflectors
4. Advanced Semiconductor PKG Technologies Supported by Complex Chiplets
- Global semiconductor market trends
- Analysis of PKG, material, and equipment manufacturers
- Classification and processes of semiconductor PKG
- Heterogeneous integration and 3D packaging
- Background and consortium of UCIe
5. Trends in Automotive High-Frequency Module Development for IoT/5G Era
- Trends in the automotive market (accelerated EV adoption) and related module development
- Trends in power semiconductors (SiC/GaN) and power devices
- Trends in automotive sensor modules and devices
6. Summary
This comprehensive program is designed not only to inform but also to engage participants in productive Q&A sessions following the presentations. This is an excellent opportunity to gain firsthand insight from industry experts and interact with peers in the field.
Registration Information
The seminar fee is set at 44,000 yen (including tax), with discounts for email newsletter subscribers at 39,600 yen and academic participants at 26,400 yen (including tax). Attendees can register directly through the CMC Research website, where further details about the event are also available.
Speaker Profile
Hirofumi Matsumoto has dedicated his career to the field of flexible printed circuits (FPC), assuming roles in design, overseas technical services, and research and development at Japan Mectron Co., Ltd., where he became a director in 2003. In 2020, he founded FlexLink Technology after serving as a senior advisor, leveraging his extensive expertise to contribute to advancements in communication technologies. He holds a Ph.D. from Northwestern University in mechanical engineering.
This seminar not only addresses the latest advancements in substrate technologies but also emphasizes the critical role they play in shaping our communication infrastructure's future. Join us on May 14th for an enlightening experience!
Future Seminars
For those interested, additional upcoming webinars will explore various topics, including lithium-ion batteries, biotechnology, and advancements in the semiconductor field. Be sure to check out the full list of events on the CMC Research website.