#USA #Lam Research #Semiconductor #Fremont, California #Akara

Lam Research Unveils Akara

Introduction
In a significant move for the semiconductor industry, Lam Research Corp. has introduced Akara®, a groundbreaking conductor etch technology that promises to redefine precision in plasma etching. This innovative tool has emerged as the most advanced etching solution available, facilitating the creation of complex 3D chip architectures that meet the growing demands of modern electronics.

Key Features of Akara
The Akara etcher leverages more than 20 years of Lam Research’s leadership in conductor etch technology. It employs the proprietary DirectDrive® technology, which allows for the rapid, precise creation of atomic-scale features. According to Sesha Varadarajan, Senior Vice President at Lam Research, the capabilities of Akara enable plasma responses that are a staggering 100 times faster than previous technologies.

This innovative etching tool is crucial for the fabrication of gate-all-around (GAA) transistors and advanced DRAM systems, including 6F2 DRAM and 3D NAND devices. It also lays the groundwork for technologies like 4F2 DRAM and is designed to handle emerging transistor architectures which demand critical etch steps and precise Extreme Ultraviolet (EUV) patterning. Traditional plasma etch solutions have struggled to maintain the angstrom-level precision needed for these sophisticated manufacturing processes.

Addressing Industry Challenges
As demand for semiconductors escalates, traditional manufacturing approaches face significant scaling hurdles. Dr. Y.J. Mii, Executive Vice President at TSMC, emphasized that innovative technology solutions, such as Akara, are essential in overcoming production challenges posed by the new generation of semiconductor devices. Its proprietary solutions target common pitfalls in plasma etching that could impact production efficiency.

Technological Innovations
Akara’s technical advancements are noteworthy:

• - DirectDrive Technology: This solid-state plasma source enhances responsiveness and minimizes EUV patterning defects.
• - TEMPO Plasma Pulsing: This technology allows for unprecedented control over plasma species, leading to improved etch selectivity.
• - SNAP Ion Energy Control: This cutting-edge feature shapes etch profiles with remarkable atomic precision.

Designed for high-volume production, Akara optimizes wafer output through millisecond response times and sophisticated uniformity controls that ensure consistent wafer-to-wafer performance. Its integration with Lam's Sense.i® platform incorporates Equipment Intelligence® solutions for automated maintenance, thus enhancing overall equipment effectiveness and reliability.

Real-World Applications and Adoption
Leading device manufacturers have already recognized the value of Akara, utilizing it as a production tool for advanced planar DRAM and GAA applications. The repeat orders from these industry leaders confirm the tool's reliability, efficiency, and its growing acceptance in the marketplace.

Conclusion
The launch of Akara, along with the recently announced ALTUS® Halo—a pioneering molybdenum atomic layer deposition tool—highlights Lam Research's unwavering commitment to innovation in semiconductor technology. As the industry transitions towards more complex chip designs, Akara stands as a testament to Lam's dedication to empowering chipmakers with the tools they need to thrive.

For more information about Akara and its capabilities, visit the Lam Research website.