#Germany #Nuremberg #Silex Technology #Qualcomm QCS6490 #Edge-AI Module

Silex Technology Introduces Innovative Edge-AI Module at Embedded World 2025

Silex Technology has unveiled its latest product, the AMC Edge System-on-Module (SoM), EP-200Q, at the Embedded World Exhibition & Conference 2025 held in Nuremberg, Germany. This sophisticated module is designed for industrial applications that leverage edge AI technology, providing robustness and efficiency in connectivity solutions.

The highlight of the AMC Edge SoM is its integration with Qualcomm's Dragonwing QCS6490 processor, which enables incredibly high-performance processing capabilities essential for demanding industrial applications. The EP-200Q is remarkably compact, featuring Wi-Fi 7 technology, which significantly enhances its capability for a range of Internet of Things (IoT) applications.

A Game-Changer for Industrial AI Applications

At a moment when Original Equipment Manufacturers (OEMs) require efficient, high-performance Wi-Fi solutions for edge AI applications, such as ambient monitoring and visual inspection, the AMC Edge has come to the forefront. It not only accelerates product development but also offers industry-leading connectivity options.

The EP-200Q module includes a variety of integrated components, alongside Silex’s expertise in engineering support and documentation. This unique offering allows OEMs to streamline the development process compared to conventional designs that utilize discrete components or other system-on-modules. Furthermore, Silex is prepared to offer tailored hardware solutions that meet unique specifications, making it a flexible choice for various industrial scenarios.

Key Features of the AMC Edge SoM

• - Unmatched Compactness: The module boasts the smallest form factor available for the Dragonwing QCS6490 processor.
• - Reliable Performance: Leveraging Silex’s optimized Wi-Fi drivers yields enhanced reliability over standard reference designs, improving overall system performance.
• - Simplified Integration: The pre-validated system-on-chip (SoC) Wi-Fi integration significantly reduces development time, making it easier for engineers to implement.
• - Robust Computational Power: Featuring an octa-core CPU, a Hexagon DSP, and a powerful 12-TOPS AI engine, the module is designed for power-optimized AI devices.
• - Long-term Support: The collaboration with Qualcomm ensures longevity in product support, essential for industries where product lifecycle management is crucial.

Industry Praise and Future Prospects

Yasumasa Nakayama, Vice President and President of Qualcomm Japan, expressed enthusiasm about Silex's introduction of the AMC Edge SoM, highlighting its compact design and optimized drivers as revolutionary for power-efficient industrial AI applications.

Keith Sugawara, CEO and President of Silex Technology America, also emphasized how this development represents a significant milestone not only for Silex Technology but also for OEMs engaged in crafting intelligent industrial devices. Silex's collaboration with Qualcomm has paved the way for bringing a groundbreaking product to market, which is both small and efficient.

For those interested in exploring the AMC Edge further, Silex Technology invites you to visit their booth at the Embedded World Exhibition & Conference, located at Hall 5-336. Additional details about the product can also be found on their official website, available at silextechnology.com.

About Silex Technology

Silex Technology is recognized globally for its innovative solutions in reliable wireless connectivity. With extensive experience in the Wi-Fi sector, Silex offers a comprehensive suite of embedded wireless modules, SoMs, and tailored network system solutions. Their services encompass the entire development process, helping device manufacturers to reduce costs and expedite market readiness. For more information, visit silextechnology.com.