Conprofe Unveils Groundbreaking Ultrasonic-Green Solutions at CIMT 2025

Conprofe Introduces Its Cutting-Edge "Dual Ultrasonic-Green" Solutions at CIMT 2025

At the CIMT 2025, one of the world's foremost exhibitions dedicated to machine tools, Conprofe made headlines by showcasing 12 advanced models of its CNC Ultrasonic-Green tool machines. This exhibition, held at booth W2-B001 over an expansive 800 square meters, attracted significant interest from key players in the high-end manufacturing sector.

Conprofe is renowned for its innovative role in delivering eco-friendly ultrasonic CNC machines geared towards highly efficient processing of hard and fragile materials, composites, and difficult-to-cut metals. The company has successfully sold over 500,000 ultrasonic systems globally, securing a formidable foothold in the realm of ultrasonic-assisted machining technologies.

Among its latest several innovations, the star highlight was the launch of the Dual Ultrasonic-Green MBR6030-5AXIS 5-axis portal machining center. According to Conprofe's R&D Head, this machine is particularly designed to tackle congestion challenges in composite material processing within the aerospace industry. What sets the MBR6030-5AXIS apart is its dual ultrasonic machining system paired with dual green cooling technology. This machine resolves common problems faced by the industry, such as the complexity of shifting between milling and composite cutting using dual heads or spindles. Instead, it consolidates these processes into a singular spindle with automatic tool change capabilities, ensuring substantial cost savings and a streamlined operational process that heightens efficiency and yield.

Additionally, the machine is equipped with crucial cryogenic cooling options powered by CO2 and cryogenic sandblasting, which altogether contribute to a sustainable increase in productivity.

Another impressive exhibit at the event was the UEM-600 Ultrasonic Milling and Engraving Center, recognized with the SEMICON Innovation Award. This center features a 50,000 RPM ultrasonic spindle that excels in machining hard and fragile semiconductor materials, such as quartz glass, silicon carbide, and silicon nitride. It is capable of creating ultra-deep micro-holes (D0.45 mm, depth-to-diameter ratio of 551) in curved single crystal silicon electrodes, significantly outperforming traditional processes like EDM, laser, and conventional CNC, thereby generating high demand from customers in the semiconductor industry worldwide.

Conprofe's eco-friendly ultrasonic machining solutions redefine CNC technology, marking a generational leap in ultrasonic processing. Their patented ultrasonic spindles combined with an intelligent CNC system featuring adaptive closed-loop amplitude control ensure exceptional precision and stability, offering efficient and environmentally friendly options for working with complex materials.

During CIMT 2025, Conprofe also secured strategic cooperation agreements and sales contracts with agents in Taiwan and Malaysia, while fostering collaborations with agents across France, Italy, Turkey, Japan, South Korea, and Singapore. This highlights a substantial advancement in the company’s global expansion efforts.

As Conprofe continues to innovate within the CNC machining landscape, it emphasizes its commitment to sustainability and efficiency, making it a forerunner in the industry poised for future growth.