#Semiconductor #CMC Research #packaging technology

Upcoming Seminar: Semiconductor Packaging Technology Overview

Event Details

• - Host: CMC Research (cmcre.com)
• - Instructor: Shigeru Koshibe, CEO of IPAC Co., Ltd.
• - Date: December 4, 2025
• - Time: 10:30 AM to 4:30 PM
• - Platform: Zoom (Includes materials)
• - Topic: Comprehensive Explanation of Semiconductor Packaging Technology

This seminar covers essential practical skills relevant to semiconductor packaging, including resin sealing, thermal conductive materials, and structural design. With over 40 years of experience in developing encapsulating materials, our instructor will relay key points and challenges clearly.

Fees

• - General: ¥55,000 (tax included)
• - Mail Magazine Subscribers: ¥49,500 (tax included)
• - Academic: ¥26,400 (tax included)

Register here for more details and to secure your spot.

Knowledge Gained from the Seminar

Participants will learn:

• - The developmental history of semiconductor packaging
• - The evolution of semiconductor packaging technologies (methods and materials)
• - Attributes of semiconductor sealing materials (ingredients, composition, production equipment, evaluation methods, etc.)

Intended Audience

This seminar is perfect for:

• - Professionals involved in semiconductor packaging (sales and technical)
• - Individuals interested in semiconductor packaging technologies
• - Those keen on resin sealing and encapsulating materials related to semiconductors

Seminar Themes and Schedule

Theme: Comprehensive Explanation of Semiconductor Packaging Technology
Date: December 4, 2025, 10:30 AM - 4:30 PM
Participation Fees: ¥55,000

• - Mail Magazine Subscribers: ¥49,500
• - Academic price: ¥26,400

Instructor: Shigeru Koshibe, CEO of IPAC Co., Ltd.

Seminar Objectives

Semiconductors are the backbone of modern society, widely considered the