#Japan #Tokyo #Advanced Packaging #Ushio #UX-59113

Ushio Corporation Unveils Latest Stepper Exposure Equipment

Ushio Corporation, headquartered in Tokyo and led by President Takafumi Asahi, has officially announced the upcoming release of their groundbreaking stepper exposure equipment, UX-59113. This innovative device will feature a resolution of L/S=1.5μm and is designed for advanced semiconductor packaging applications. Ushio plans to introduce this state-of-the-art equipment to the market by the fiscal year 2026.

The UX-5 series, of which the UX-59113 is a key component, serves as the backbone of semiconductor packaging for a variety of devices, including computers, smartphones, and tablets. With a commanding 90% global market share in advanced IC package board exposure equipment, Ushio plays a pivotal role in this sector, continuously progressing technology to meet the increasing demand for high-performance semiconductors.

Given the rapid proliferation of IoT technologies and the expansion of generative AI applications, there has been a marked increase in the need for data center-oriented, high-performance semiconductors. This necessitates advancements in semiconductor packaging, especially in the area of chiplets, where fine wiring and larger package sizes are both critical trends. Consequently, the demand for panel-level packaging utilizing resin and glass substrates is expected to rise significantly.

Traditionally, steppers used for wafer processing have struggled with the growing size of package substrates. The stitching process, which involves connecting multiple shots, can compromise yield and productivity due to misalignments during assembly. However, the UX-59113 addresses this issue by enabling exposure of sizes over 100mm at the 1.5μm resolution in a single shot, eliminating the need for stitching. This improvement is anticipated to enhance yield and production efficiency substantially during large-scale manufacturing.

Moreover, the UX-59113 is engineered to accommodate next-generation technologies, including glass materials and full panel size substrates. It also tackles challenges associated with warping and waviness, leveraging advanced handling technologies developed through decades of expertise in semiconductor packaging.

Ushio continues to advance the functionality of stepper systems tailored for advanced package boards to the highest levels achievable globally, leveraging its proprietary optical design technology and industry experience.

Key Features of the UX-59113 Stepper Exposure Equipment Include:

• - A resolution of 1.5μm and a large exposure field exceeding 100mm in one shot
• - Custom-designed light sources and other components for enhanced performance
• - Integration of a transport platform capable of handling full panel size organic and glass substrates

As part of its growth strategy in the semiconductor advanced packaging sector, Ushio is not only enhancing its existing lineup of traditional steppers and maskless direct imaging systems but is also collaborating with Applied Materials to introduce the new DLT equipment by December 2023. This partnership aims to comprehensively meet the diverse needs of next-generation package applications.

The incorporation of the UX-59113 into Ushio's stepper lineup reflects the company's commitment to addressing the varied requirements of its customers and contributing to technological innovations in next-generation packaging boards, especially in the realm of AI-driven semiconductor manufacturing.

As a leading company in advanced IC package board exposure equipment, Ushio remains dedicated to promoting a convenient and comfortable society through its cutting-edge optical technologies.

Company Overview

Founded in 1964, Ushio Corporation is a major player in the optical technology industry. The company specializes in various light sources, including UV, visible, and infrared spectrum, as well as lasers and LEDs. Ushio manufactures and sells optical and imaging devices utilized across numerous fields, such as semiconductors, flat panel displays, and electronic component manufacturing. In recent years, they have expanded their operations into life science sectors, including medical and environmental markets, thereby strengthening their diverse portfolio.

For more information, visit Ushio's website.