Sumitomo Bakelite to Participate in ECTC 2026 International Conference on Advanced Semiconductor Technology

Sumitomo Bakelite at ECTC 2026

Sumitomo Bakelite Co., Ltd., headquartered in Shinagawa, Tokyo, will take part in the IEEE 76th Electronic Components and Technology Conference (ECTC 2026) scheduled from May 26 to 29 in Orlando, Florida. This prestigious international conference is one of the largest gatherings focused on next-generation semiconductor packaging technologies, including emerging AI semiconductor technologies. During the event, the company, in collaboration with academic institutions and corporate partners, will present three significant research findings.

In recent years, the proliferation of AI semiconductors has raised the demand for semiconductor packaging that offers enhanced performance, reliability, and density. Sumitomo Bakelite is actively promoting partnerships with external collaborators to accelerate the development of materials and technologies suitable for next-generation semiconductors. At ECTC 2026, the company will unveil its research outcomes, which include:

Presentation Details

1. Low Dielectric RDL Material for Glass Packages

(Collaborative Research with Georgia Tech)
Technical Session No. 27
Date: May 29 (Friday) 9:30–12:35
Through the use of a liquid photo-sensitive material characterized by low curing shrinkage, low-temperature curing properties, and low dielectric characteristics, we successfully formed a high-density copper re-routing layer on a glass substrate, achieving the first-ever demonstration of multilayer wiring with micro vias.

2. Optoelectronic Fusion RDL Interposer Technology

(Collaborative Research with Tohoku University)
Technical Session No. 33
Date: May 29 (Friday) 14:00–17:05
We propose an integrated CPO-based optical RDL interposer technology using multifunctional photo-curable polymers, carrying out technical demonstrations related to polymer waveguides and hybrid bonding.

3. High Thermal Conductivity Sealing Materials for Automotive Applications

(Collaborative Research with SPIL/MediaTek)
Technical Session No. 9
Date: May 27 (Wednesday) 14:00–17:05
By optimizing resin design and filler composition, we have developed sealing materials for automotive semiconductors that achieve both high thermal conductivity and reliability. This outcome contributes to the reliability of high-density automotive packaging and adheres to AEC-100 standards.

Sumitomo Bakelite is dedicated to exploring the potential of plastics, contributing to environmental sustainability, society, and people's lives through value creation. The company continues to aim for an enhanced presence in the global market and is committed to contributing to the evolution of next-generation semiconductors through advanced material technology development.

Overview of ECTC 2026

Event Name: IEEE 76th Electronic Components and Technology Conference (ECTC 2026)
Dates: May 26 (Tuesday) - May 29 (Friday), 2026
Venue: JW Marriott & The Ritz-Carlton Grande Lakes, Orlando, Florida, USA
Website: https://ectc.net/

Contact Information

For inquiries, please contact:
Sumitomo Bakelite Co., Ltd.
Information and Communication Materials Sales Department
TEL: 03-5462-4015
Inquiry Form: https://inquiry.sumibe.co.jp/m/j_company