E&R Engineering Showcases Innovative CPO and Advanced Packaging Solutions at SEMI West 2026
E&R Engineering Unveils Cutting-Edge Technologie at SEMI West 2026
On October 6, 2026, E&R Engineering Corp., a leader in semiconductor laser and plasma processing technologies, announced its plans to showcase state-of-the-art innovations at SEMI West 2026. Taking place from October 13 to 15, 2026, at the Moscone Center in San Francisco, California, this event is anticipated to attract attention from industry experts and partners.
The focus of E&R's presentation will be on high-precision micromachining techniques, particularly targeting Fiber Array Units (FAUs). The company will introduce its latest breakthroughs in laser drilling technology, achieving remarkable accuracy levels of ±0.5 μm through five-axis laser drilling systems. This level of precision is crucial for the increasing demand in high-speed optical communication, where tight tolerances are paramount.
High-Precision Laser Machining Solutions
In response to the market's growing requirements for dense optical components, especially within Co-Packaged Optics (CPO), E&R Engineering has developed a high-precision FAU laser processing solution. These systems support speeds up to 12.8 Tbit/s, showcasing their ability to handle the bandwidth needs of modern optical networks. The technology integrates sophisticated five-axis laser control, precision positioning, and advanced micromachining techniques.
Furthermore, E&R is committed to advancing the packaging capabilities for next-generation AI and High-Performance Computing (HPC) applications. By offering a comprehensive processing portfolio for 2.5D/3D integrated circuits and high-density substrates, the company meets the rigorous demands imposed by modern architectures. Key capabilities include high-precision laser drilling with ±5 μm accuracy and high-throughput multi-beam laser marking, ensuring both performance and efficiency.
Seamless Integration and Process Optimization
One of the standout features of E&R’s offerings is the seamless integration of these technologies into existing manufacturing processes. Whether it's controlled thermal laser cutting or defined ABF grooving, the advanced processing platform optimizes production from initial design validation through to large-scale deployment. E&R emphasizes the importance of integrating laser debonding seamlessly into packaging workflows while utilizing high-stability plasma systems to enhance surface cleaning and activation.
Local Support for North American Operations
E&R Engineering places a high priority on customer service and technical support across the United States. With local teams stationed in major cities like Portland, Arizona, and Texas, the company can ensure rapid response times. Through remote diagnostics and tailored technical assistance, they strive to minimize downtime and optimize throughput for their North American semiconductor partners.
Join Us at SEMI West 2026
Attendees of SEMI West 2026 can visit E&R Engineering at Booth 2153 in the South Hall. The event provides an excellent opportunity for professionals to engage with cutting-edge technology and glean insights from E&R's experts.
For more information about E&R Engineering, visit their official website at E&R Engineering. Don’t miss the chance to witness the future of semiconductor technology at one of the industry's leading exhibitions!
Event Details:
- - Dates: October 13 – 15, 2026
- - Location: Moscone Center, San Francisco, CA, USA
- - Booth: South Hall, Booth No. 2153
E&R Engineering looks forward to cultivating new partnerships and pushing the boundaries of what's possible in semiconductor processing.
Topics Consumer Technology）
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