Leopard Imaging Unveils Innovative IP Camera and USB Adapter at Embedded Vision Summit 2025
Leopard Imaging's Groundbreaking Innovations at Embedded Vision Summit 2025
Leopard Imaging Inc., renowned for its advanced embedded vision and AI camera solutions, is thrilled to announce the launch of two cutting-edge products at the upcoming Embedded Vision Summit 2025. These products include the rugged LI-IMX662-RV-GigE-118H industrial IP camera and the high-speed LI-GMSL3-USB3.2 adapter board.
Innovative Features of the LI-IMX662-RV-GigE-118H
Engineered to thrive in harsh environments, the LI-IMX662-RV-GigE-118H features the IMX662 sensor, which ensures exceptional low-light imaging alongside a resolution of 1937 x 1097 pixels. Its IP67-rated housing guarantees protection from dust and water, making it perfectly suited for various applications across robotics, drones, and factory automation.
The camera boasts an impressive 118° horizontal field of view and performs flawlessly in extreme temperatures ranging from -30℃ to +70℃. This makes it an ideal choice for real-time edge AI applications where responsiveness is critical. It supports multiple sensor inputs and has a lightning-fast boot-up time of just 250 milliseconds, ensuring that operational lag is minimized.
Additionally, the LI-IMX662-RV-GigE-118H supports 4K H.264/H.265 video encoding, which facilitates high-quality video capture. Powering this robust device is made flexible through Power over Ethernet (PoE) or a 12VDC M8 connector, enhancing its versatility in deployment scenarios. The camera is equipped with a 2.8mm focal length lens (F/2.1 aperture) with a 650nm IR cut filter, and an M12 lens mount engineered to reduce optical distortion by less than -63%, ensuring superior imaging fidelity even in challenging industrial settings.
Powerful Capabilities of the LI-GMSL3-USB3.2 Adapter Board
Complementing the camera's powerful functionality is the LI-GMSL3-USB3.2 adapter board, designed for high-speed data transfer. This adapter board utilizes a USB 3.2 Gen 2 Type-C interface, facilitating data transfer speeds of up to 10Gbps. It can support up to four GMSL3 FAKRA cameras, making it exceptionally valuable for automotive applications and advanced robotic vision systems.
The board comes outfitted with robust features such as built-in overcurrent protection and LED indicators for safety and user convenience. Its design ensures that seamless connectivity and real-time video streaming can occur without interruptions, which is crucial for dynamic environments where quick data processing is essential.
Expansion of Manufacturing Facilities
In addition to the product launch, Leopard Imaging is expanding its capabilities with a new manufacturing facility in Malaysia. This strategic move aims to bolster the company’s global supply chain and increase its production capacity, thereby allowing it to meet rising global demands efficiently. Alongside its existing operations in the U.S., this expansion signifies Leopard Imaging’s commitment to rapid innovation in the AI camera market.
Join Us at the Embedded Vision Summit 2025
Leopard Imaging invites attendees to Booth #700 at the Embedded Vision Summit 2025 for live demonstrations of these groundbreaking products and hands-on access to their features. This event represents an opportunity for industry professionals to engage with cutting-edge technology that’s shaping the future of industrial automation and AI-driven imaging.
For inquiries or to set up a meeting during the summit, please reach out via email at [email protected]
About Leopard Imaging Inc.
Founded in 2008, Leopard Imaging has established itself as a frontrunner in the field of high-definition embedded cameras and AI imaging solutions. The company is dedicated to enhancing image processing technologies across various sectors, such as automotive, aerospace, IoT, and robotics. As an NVIDIA Elite Partner, Leopard Imaging is recognized for its high-quality manufacturing practices and adherence to industry standards, ensuring the reliability of its products.