#Laser Technology #Malaysia #Kuala Lumpur #E&R Engineering #SEMICON SEA

E&R Engineering to Lead with Advanced Technologies at SEMICON SEA 2026

ER Engineering (8027.TW) is set to unveil its state-of-the-art laser and plasma solutions at the highly anticipated SEMICON Southeast Asia 2026, scheduled for May 5-7, 2026. This event, taking place at the Malaysia International Trade and Exhibition Centre (MITEC), will serve as a platform for the company to present its cutting-edge technologies that cater to the increasingly complex demands of the semiconductor manufacturing sector.

In collaboration with Horng Terng Automation (HTA) and Group Up Industrial (GP), ER Engineering aims to deliver fully integrated turnkey solutions tailored to address critical needs in artificial intelligence, advanced packaging, and next-generation manufacturing processes. With a focus on precision and efficiency, the partnership epitomizes the future of semiconductor technology.

Technology Highlights

Among the highlights at ER Engineering's display will be:

• - High-Precision Laser Drilling: Capable of accommodating both 2.5D and 3D integrated circuits (ICs) with a precision of ±5 μm and a break-through ratio of up to 90%.
• - Multi-Beam Laser Marking: Providing an accuracy of ±25 μm and enhanced throughput, it represents a leap forward in laser marking technology.
• - Controlled Thermal Laser Cutting: Another innovative application aimed at optimizing manufacturing efficiency.
• - Microwave and RF Plasma Cleaning: Essential for pre-underfill processes and surface activation.
• - Hybrid Plasma Solutions: Designed for high-efficiency dry etching applications.

Automation Integration Service (AIS)

ER Engineering's Automation Integration Service leverages over 30 years of expertise in customized automation solutions that meet diverse Computer Integrated Manufacturing (CIM) and factory requirements. By seamlessly integrating multi-vendor process modules into a cohesive, high-efficiency system through simulation-driven modeling, ER Engineering delivers a unified user interface and a singular service point.
The dedicated research and development teams, along with proactive sales support, ensure that every project receives direct engagement and quick technical assistance.

Implementation in Advanced Packaging

ER’s solutions effectively support large panel processes such as Fan-Out Panel Level Packaging (FOPLP), incorporating critical processes such as laser marking, cutting, plasma cleaning, and post-process drilling de-smearing. Notably, the process boasts impressive warpage control of up to 16 mm, further enhanced by laser debonding and plasma dry etching for the seamless separation of glass carriers from panels.

Join Us and Experience the Future

Attendees at SEMICON SEA 2026 are invited to visit ER Engineering at booth #1452, where they can witness firsthand how ER, in collaboration with HTA and Group Up, is setting new benchmarks in semiconductor manufacturing through innovative, precise, and integrated solutions.
To learn more about ER Engineering’s offerings and this event, please visit ER Engineering's website.