A Leap Forward in Thermal Imaging
HIKMICRO, a global leader in thermal imaging solutions, has unveiled its cutting-edge algorithms, SuperScene™ and SuperScene+™, which redefine the inspection landscape across various domains, including residential construction, electrical systems, and industrial settings. These advanced technologies are designed for all users, enabling even beginners to achieve professional-level accuracy in their inspections.
What is SuperScene?
SuperScene™ is a remarkable innovation that employs deep learning techniques to enhance thermal inspections. The algorithm is adept at identifying air leaks, heat losses, and moisture damage, providing a comprehensive overview of a structure’s thermal integrity. The software, integrated into HIKMICRO’s handheld and pocket devices, boasts an extensive database of thermal images representing typical issues such as inadequate insulation and water leaks.
Available in transition stages, SuperScene™ simplifies the inspection process significantly, making it swift and precise. For professionals, it acts as an essential tool, ensuring results that were previously achievable only through extensive training and experience.
Enhanced Features with SuperScene+
In addition to SuperScene™, HIKMICRO has introduced SuperScene+, which offers automated anomaly detection specifically for inspecting electrical cabinets and PCB safety. This upgrade minimizes workflow complexity for technicians by integrating smart algorithms that pinpoint temperature measurement targets, flagging anomalies in real-time. With a focus on safety and reliability, SuperScene+ not only enhances the inspection process but also mitigates downtime risks associated with equipment failures.
For example, while inspecting electrical cabinets, SuperScene+ combines image recognition with delta-T algorithms to accurately identify overloaded or degraded fuses through absolute temperature alarms and relative differential warnings. Additionally, micro-temperature sensors are capable of detecting temperature discrepancies as minimal as 0.5°C, allowing for early intervention before risks escalate.
In the realm of PCB inspections, SuperScene+ utilizes pre-configured templates and AI calibration to execute a high-density board check, identifying short circuits, cold connections, and overloads efficiently. This automation drastically reduces calibration times, bringing the average from over 30 minutes to under 5, enhancing operational efficiency.
User-Friendly Design
Further enhancing user experience, HIKMICRO’s handheld and pocket cameras come equipped with a new “Pro Scene” function. This feature employs an intuitive color algorithm coupled with additional tools like hygrometers, facilitating the analysis and marking of thermal images based on temperature and humidity readings. This casement significantly aids in pinpointing potential insulation flaws and moisture issues, highlighted with easily recognizable color-coded alerts, making inspections clearer and more effective.
Transformational Impact
With these innovations, HIKMICRO is not only pioneering advancements in thermal imaging technology but is also making this sophisticated instrumentation accessible. From identifying water leaks to ensuring industrial safety, the SuperScene technologies exemplify how high-tech solutions can cater to both seasoned professionals and beginners alike. HIKMICRO’s commitment to quality and efficacy sets a new standard in the realm of thermal inspection technology, turning challenges into streamlined operations.
In conclusion, as the landscape of technology evolves, HIKMICRO stands at the forefront, empowering users with tools that are not only intelligent but also uncomplicated to use. With SuperScene and SuperScene+, every inspection becomes smarter, decisions are expedited, and outcomes become more reliable.
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