Ceva's Advanced Connectivity IPs Enhance Bestechnic's Smart Device Lineup
In a significant stride towards advancing smart device technologies, Ceva, Inc. has announced an extension of its partnership with Bestechnic. This collaboration introduces innovative combo products that integrate Ceva's powerful Wi-Fi 6 and Bluetooth Dual Mode IPs, aiming to elevate the functionalities of smart wearables, smart home devices, and smart audio solutions.
Founded in 2015, Bestechnic has swiftly gained recognition as a global leader in ultra-low power computing System on Chips (SoCs) catering to various wireless connectivity applications. With over 1 billion smart audio SoCs shipped globally relying on Ceva’s Bluetooth technology, Bestechnic has solidified its presence in the market, particularly in TWS earbuds, smart glasses, smartwatches, and smart speaker sectors.
As reports from ABI Research predict around 2.7 billion Wi-Fi 6 units per annum by 2027, the growing integration of this technology in smart audio devices has become imperative. Wi-Fi 6 not only enhances efficiency and performance but also significantly lowers power consumption, making it ideal for battery-operated devices. This efficiency is crucial for devices tasked with high-definition audio streaming amidst the increasing demand for real-time data processing powered by embedded AI.
The new combo families introduced by Bestechnic include the BES2610 and BES2800, which effectively combine high-throughput wireless connectivity with power efficiency. The platform enables dual-mode Bluetooth 5.4 capability, providing versatility through traditional Bluetooth and LE audio modes, while the incorporation of the Wi-Fi 6 subsystem establishes robust connectivity that enhances audio quality without sacrificing battery life.
Zhao Guoguang, General Manager of Bestechnic, expressed enthusiasm over this collaboration, stating, "Our long-standing partnership with Ceva has been instrumental to our success, and we are excited to incorporate their Wi-Fi 6 IP into our newest combo device families. This collaboration allows us to offer our customers cutting-edge wireless solutions tailored to high-definition audio streaming and ultra-low power needs for wearables."
Tal Shalev, Vice President and General Manager of the Wireless IoT Business Unit at Ceva, highlighted the significance of this collaboration, pointing out how it showcases the wireless connectivity portfolio's exceptional ability to adapt to emerging trends in the market. He stated, “Embedded AI is rapidly becoming integral to various devices; thus, seamless connectivity is paramount. Our Wi-Fi 6 technology, facilitating data transmission alongside Bluetooth for streaming audio applications, enables Bestechnic to set new standards in smart audio devices.”
The integration of Ceva-Waves Wi-Fi to their newly launched ultra-low power Bluetooth/Wi-Fi chips underscores the adaptability of the devices for powering applications focused on audio quality while balancing low energy consumption. With a current draw as low as 14mA for 2.4GHz Wi-Fi RX, these chips are quintessential for devices like smartwatches and earbuds that prioritize battery longevity.
Notably, the Ceva-Waves Wi-Fi IP family encompasses a wide range of IP platforms designed to integrate Wi-Fi connectivity into SoCs/ASSPs, suitable for varied applications from low power IoT devices to high-performance gateways. The diversity of these solutions ensures that they can cater to the increasingly demanding needs of innovative products in the smart technology landscape.
Both Ceva and Bestechnic aim to push the envelope in the realms of wireless connectivity and smart technology solutions. As they continue to innovate and respond to market needs, one can anticipate a wave of products that not only leverage high-performance connectivity but also address the demanding requirements of modern consumers seeking efficiency and quality in their electronic devices.
For more details about Ceva and Bestechnic, please refer to their respective websites: Ceva and Bestechnic.
Founded in 2015, Bestechnic has swiftly gained recognition as a global leader in ultra-low power computing System on Chips (SoCs) catering to various wireless connectivity applications. With over 1 billion smart audio SoCs shipped globally relying on Ceva’s Bluetooth technology, Bestechnic has solidified its presence in the market, particularly in TWS earbuds, smart glasses, smartwatches, and smart speaker sectors.
As reports from ABI Research predict around 2.7 billion Wi-Fi 6 units per annum by 2027, the growing integration of this technology in smart audio devices has become imperative. Wi-Fi 6 not only enhances efficiency and performance but also significantly lowers power consumption, making it ideal for battery-operated devices. This efficiency is crucial for devices tasked with high-definition audio streaming amidst the increasing demand for real-time data processing powered by embedded AI.
The new combo families introduced by Bestechnic include the BES2610 and BES2800, which effectively combine high-throughput wireless connectivity with power efficiency. The platform enables dual-mode Bluetooth 5.4 capability, providing versatility through traditional Bluetooth and LE audio modes, while the incorporation of the Wi-Fi 6 subsystem establishes robust connectivity that enhances audio quality without sacrificing battery life.
Zhao Guoguang, General Manager of Bestechnic, expressed enthusiasm over this collaboration, stating, "Our long-standing partnership with Ceva has been instrumental to our success, and we are excited to incorporate their Wi-Fi 6 IP into our newest combo device families. This collaboration allows us to offer our customers cutting-edge wireless solutions tailored to high-definition audio streaming and ultra-low power needs for wearables."
Tal Shalev, Vice President and General Manager of the Wireless IoT Business Unit at Ceva, highlighted the significance of this collaboration, pointing out how it showcases the wireless connectivity portfolio's exceptional ability to adapt to emerging trends in the market. He stated, “Embedded AI is rapidly becoming integral to various devices; thus, seamless connectivity is paramount. Our Wi-Fi 6 technology, facilitating data transmission alongside Bluetooth for streaming audio applications, enables Bestechnic to set new standards in smart audio devices.”
The integration of Ceva-Waves Wi-Fi to their newly launched ultra-low power Bluetooth/Wi-Fi chips underscores the adaptability of the devices for powering applications focused on audio quality while balancing low energy consumption. With a current draw as low as 14mA for 2.4GHz Wi-Fi RX, these chips are quintessential for devices like smartwatches and earbuds that prioritize battery longevity.
Notably, the Ceva-Waves Wi-Fi IP family encompasses a wide range of IP platforms designed to integrate Wi-Fi connectivity into SoCs/ASSPs, suitable for varied applications from low power IoT devices to high-performance gateways. The diversity of these solutions ensures that they can cater to the increasingly demanding needs of innovative products in the smart technology landscape.
Both Ceva and Bestechnic aim to push the envelope in the realms of wireless connectivity and smart technology solutions. As they continue to innovate and respond to market needs, one can anticipate a wave of products that not only leverage high-performance connectivity but also address the demanding requirements of modern consumers seeking efficiency and quality in their electronic devices.
For more details about Ceva and Bestechnic, please refer to their respective websites: Ceva and Bestechnic.
Topics Consumer Technology）
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