#Denmark #Copenhagen #Marvell Technology #AI Data Centers #ECOC 2025

Marvell Showcases Interconnect Innovations at ECOC 2025

Marvell Technology, Inc. is leading the way in the semiconductor solutions space with a strong focus on data infrastructure. During the upcoming European Conference on Optical Communication (ECOC) 2025, occurring from September 28 to October 2 in Copenhagen, Denmark, Marvell plans to highlight its comprehensive interconnect portfolio that is designed specifically to meet the needs of scale-up and scale-out data center deployments tailored for artificial intelligence (AI).

The Demand for Advanced Interconnect Solutions

The landscape of data center architecture is rapidly changing due to the integration of generative AI technologies and extensive large-scale models. This evolution creates an unprecedented demand for enhanced interconnect performance, increased bandwidth, and improved power efficiency. As major tech companies, known as hyperscalers, expand their AI computing clusters across various locations, we see a significant necessity for advanced interconnect technologies that can support these growing infrastructures smoothly. Marvell is actively responding to these challenges with a full-stack methodology that effectively combines sophisticated silicon platforms, chiplet-oriented architectures, and innovative optical technologies.

With these advancements, Marvell aims to deliver unparalleled performance across data center fabrics that are both scalable and efficient. This innovative approach also addresses the critical issues of latency and energy consumption while facilitating quicker deployments at cloud scale.

Key Technologies on Display

At its stand (#C4134) at ECOC 2025, Marvell is set to showcase several cutting-edge technologies aimed at revolutionizing AI interconnects, including:

• - Co-packaged Optics (CPO) for AI Scaling: A new CPO platform supporting 200G per lane connectivity for energy-efficient, high-bandwidth links that bridge multiple racks within an AI scale-up environment.
• - Marvell® COLORZ® 800G ZR/ZR+: The first-ever family of 800 Gbps ZR/ZR+ coherent pluggable optical modules. This technology can transmit data over distances of up to 2,000 kilometers, making it a cost-efficient option for interconnecting geographically dispersed AI clusters.
• - 200G/Lambda 1.6T PAM4 Optical Interconnect: The Marvell Ara, a groundbreaking 3nm PAM4 Digital Signal Processor (DSP), brings together eight 200 Gbps channels within a single optical module, simplifying the deployment of AI scale-out architectures across various arrays and data centers.

Insightful Presentations

In addition to showcasing their innovative products, Marvell representatives will deliver insightful talks on interconnect technologies designed to enhance accelerated infrastructure. Notable sessions include discussions on coherent lite technologies, advancements in 800G coherent DSP, and the transformation of rack-scale connectivity using co-packaged copper optics.

Presentations will take place on September 29 and October 2, 2025, featuring key insights from Marvell experts including Bo Zhang and Rohan Gandhi, which is expected to generate significant interest among attendees looking to keep up with the latest trends and technologies in the field.

About Marvell Technology

For over three decades, Marvell Technology has been at the forefront of semiconductor solutions, committed to transforming how data is processed, stored, managed, and secured. Through strategic partnerships and collaborative approaches, Marvell empowers leading technology companies around the globe, fulfilling both present-day data needs and future ambitions. Its robust solutions are foundational to harnessing the power of the cloud, enterprise functions, and carrier infrastructures.

As one of the frontrunners in the data infrastructure realm, Marvell's innovations are poised to reshape the future of interconnect technologies and data center efficiency significantly. For more information, visit Marvell's website.