Synopsys Unveils Advanced EDA Tools for AI and Multi-Die Integration at SAFE Forum 2026

Synopsys Unveils Advanced EDA Tools at SAFE Forum 2026



On May 28, 2026, Synopsys, Inc. made headlines at the Samsung Advanced Foundry Ecosystem (SAFE) Forum 2026, presenting groundbreaking collaborations with Samsung Foundry aimed at advanced semiconductor technology. This partnership focuses on a range of exciting innovations aimed to accelerate market introduction for AI and multi-die designs.

Introduction of AI-Powered Tools


Synopsys announced a suite of production-ready, AI-enhanced electronic design automation (EDA) tools, as well as an expanded range of certified interface IPs, vital for second and third-generation 2nm processes. The enhancements promise not only to streamline the design process but also to improve the overall quality of the chips produced, allowing clients to meet increasingly demanding market requirements.

During the event, Synopsys President and CEO Sassine Ghazi emphasized the imperative to tackle the complexities that arise in semiconductor engineering. He pointed out how recent advancements in AI have transformed the approach to automation, integrating multiphysics intelligence within the entire design and manufacturing process. As a result, companies can expect quicker production timelines without compromising on quality.

Significant Efficiency Gains


With the introduction of these advanced methodologies, clients leveraging Synopsys' AI-driven solutions are noticing substantial enhancements in power, performance, and area (PPA). Initial reports suggest customers are achieving up to a 20% increase in test efficiency, illustrating the tangible benefits of these new tools. This leap in capability highlights the effectiveness of close cooperation between Synopsys and Samsung Foundry, which has long been a strategic collaboration in the pursuit of semiconductor innovation.

Vice president of Samsung's Foundry Design Technology Team, Hyung-Ock Kim, reiterated the importance of synergy in design, testing, and manufacturing processes for successful multi-die solutions. This collaboration is designed to reduce design integration risks and improve predictability, ensuring that clients can transition seamlessly from design to production with confidence.

Recent Innovations Delivered


One of the standout offerings includes Synopsys' new production-ready AI-powered digital and analog design flows, particularly beneficial for third-generation 2nm processes. The Synopsys Fusion Compiler™ has been optimized to provide measurable improvements in power and performance when compared to its predecessors. Additional tools like Synopsys PrimeShield™ are also offering significant enhancements in signoff processes by supporting design-specific optimizations informed by real silicon feedback, leading to better power integrity and reliability.

Moreover, through the deployment of AI-assisted automatic test pattern generation (ATPG) technologies within the Synopsys TestMAX™ framework, clients can significantly reduce test costs while maintaining quality. This use of silicon-proven methodologies reflects the industry’s shift towards integrated test capabilities, particularly for complex AI-driven designs.

Enabling Advanced Innovations


The collaborative efforts with Samsung do not stop there. Designers can look forward to leveraging certified multiphysics signoff solutions integrated within the Synopsys 3DIC Compiler. This platform represents a revolution in scalable multi-die design, utilizing advanced Hybrid Copper Bonding technology to enhance automation and overall designer productivity.

Synopsys is also broadening its intellectual property (IP) portfolio to reduce integration risks for applications spanning sectors including consumer electronics and automotive. The incorporation of advanced IP like UCIe, PCIe 7.0, and DDR5 is tailored specifically to meet the needs of Samsung's latest foundry processes. With this expansive offering, Synopsys is set to conquer the competitive landscape, enabling customers to navigate the complexities associated with advancing technology.

Conclusion


The 2026 SAFE Forum showcased the thriving partnership between Synopsys and Samsung Foundry, emphasizing the need for innovation co-creation in the semiconductor industry. This brand collaboration not only enhances performance but also sets a new standard for future advancements in AI and multi-die design. As these tools become integral in the design flow, they signal exciting times ahead for semiconductor technology at large—a future of faster, more efficient, and more reliable product development.

For updates on Synopsys' offerings and collaborations, visit their official website or follow them on LinkedIn.

Topics Consumer Technology)

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