#China #Beijing #Ultrasonic-Green #Conprofe #CNC

Conprofe's Dual Ultrasonic-Green CNC Solutions Unveiled at CIMT 2025

At the prestigious CIMT 2025, the world's leading machine tool exhibition held in Beijing, Conprofe made headlines by introducing twelve state-of-the-art ultrasonic-green CNC machine models. This substantial exhibition at their expansive 800-square-meter booth (W2-B001) captured considerable attention in the high-end manufacturing sector.

As an innovator in the production of eco-friendly ultrasonic CNC machinery, Conprofe specializes in providing high-efficiency solutions for machining hard materials, fragile components, and difficult-to-cut metals. Having successfully sold over 500,000 ultrasonic systems globally, the company establishes itself as a leader in the field of ultrasonic-assisted machining technology.

Among the showcased highlights was Conprofe's dual ultrasonic-green gantry machining center, the MBR6030-5AXIS. The R&D director stated, “This gantry machine is designed to tackle bottlenecks in the aerospace industry when machining various composite materials.” The MBR6030-5AXIS includes dual ultrasonic machining systems and eco-friendly cooling features. While the industry typically finds it challenging to utilize dual milling heads or spindles to alternate between cutting and milling composite materials, this innovative machine offers automatic tool change functionality with a single spindle. This design leads to significant cost savings, process optimization, enhanced efficiency, and improved performance. It also includes options for cryogenic cooling with supercritical CO2 and cryogenic blow-off, effectively boosting productivity in a sustainable manner.

Another standout display was the award-winning Ultrasonic Engraving and Milling Center, the UEM-600, which garnered the SEMICON Innovation Award. This model features an ultrasonic spindle reaching 50,000 RPM and excels in machining brittle semiconductor materials such as quartz glass, silicon carbide, and silicon nitride. It can achieve ultradeep micro-hole drilling (D0.45 mm, a depth-to-diameter ratio of 551) on curved monocrystalline silicon electrodes, surpassing the efficiency and quality standards set by conventional CNC, laser, and electro-erosion methods. This breakthrough has led to a significant global demand for semiconductor manufacturing solutions.

Conprofe’s ultrasonic-green machining solutions are redefining CNC technology, representing a generational leap in ultrasonic machining capabilities. With patented worldwide ultrasonic spindles and an intelligent closed-loop CNC control system featuring amplitude and adaptive control, these solutions ensure exceptional precision and stability. They offer both efficient and environmentally friendly options for machining complex materials.

During CIMT 2025, Conprofe also established strategic cooperation agreements and sales contracts with regional agents from Taiwan and Malaysia while fostering collaboration with agents from France, Italy, Turkey, Japan, South Korea, and Singapore. This marks a significant step in accelerating the company's global expansion efforts.

Overall, Conprofe's unveiling at CIMT 2025 signals a promising advance in the field of machining technology, combining efficiency, innovation, and a commitment to sustainability for the modern manufacturing industry.