Ormco™ Boosts Orthodontic Solutions at AAO 2026 with Expanded Digital Bonding Technology

Ormco™ Expands Its Digital Bonding Technology at AAO 2026

At the 2026 American Association of Orthodontists (AAO) Annual Session taking place in Orlando, Florida, Ormco™ Corporation has announced significant advancements in its Digital Bonding capabilities. Celebrating over 65 years of excellence in orthodontic solutions, Ormco™ aims to transform the orthodontic landscape with the introduction of more brackets into its Digital Bonding (ODB) suite.

Expanded Digital Bonding Portfolio

Ormco™ is extending its Digital Bonding technology to a vast majority of its bracket lineup, which now includes the Damon™ Clear, Mini Diamond™, Orthos™, Titanium Orthos™, and Mini-Twin™ brackets. This expansion joins previous offerings which included Damon Ultima™, Symetri™ Clear, and Damon™ Q2 brackets. By broadening the availability of its ODB system, Ormco provides orthodontists the tools needed for greater efficiency and flexibility during treatment, ensuring they can achieve predictable clinical outcomes with ease.

Dr. Barry Bentonii, a consultant for Ormco and a practicing orthodontist, expressed his enthusiasm about the new system: "With ODB, my approach to designing and bonding cases has fundamentally changed. The precision I can achieve from the very first bond increases efficiency and allows me to keep my patients informed about their treatment paths."

Transformative EtchFree™ Bonding System

Another exciting innovation from Ormco is the EtchFree™ Bonding system, which eliminates the traditional acid etching process. This breakthrough will also be featured at the AAO's New Product Showcase and comes with a newly designed twist-top unit-dose delivery system. The advanced adhesive provides consistent bond strength, enhances clinical efficiency, and ultimately ensures a more comfortable experience for both orthodontists and their patients.

The system is particularly advantageous as it accommodates both wet and dry bonding conditions, significantly improving usability in different environments. The optimal single-arch dose format enables orthodontic teams to transition smoothly through appointments while maintaining exceptional bonding quality, further reducing waste.

Innovations Showcase at AAO

Attendees of the AAO 2026 will have the opportunity to witness these innovations firsthand and participate in voting for their favorite products showcased in the New Product Pavilion. "The AAO Annual Session is a pivotal event for orthodontic professionals, and showcasing our newest technologies like the ODB system and EtchFree™ is essential to demonstrate Ormco's commitment to advancing product efficiency and patient comfort," stated Veronica Acurio, President of Ormco.

In addition to Digital Bonding and EtchFree™, the Ormco booth will spotlight several other innovative products, including Spark™ Clear Aligners designed for customized treatment plans, the Spark™ Junior for younger patients, and the Spark™ BiteSync™ for Class II correction.

Conclusion

Ormco™ continues to revolutionize orthodontic care with cutting-edge technology that prioritizes efficiency, precision, and patient-centric solutions. Their commitment to innovation and excellence is reflected through these comprehensive offerings aimed at improving the overall treatment experience for both practitioners and their patients. For further details about their innovative solutions, visit Ormco's official website.