CoAsia SEMI and Rebellions Collaborate to Innovate AI Chiplets for the Future

A New Era in AI Semiconductor Development

In a significant development for AI technology, CoAsia SEMI and Rebellions have announced a strategic partnership aimed at creating cutting-edge AI chiplets based on Rebellions' innovative REBEL architecture. This collaboration is set to revolutionize the semiconductor industry, specifically in the realm of data centers, where robust computational capabilities are essential for handling the growing demands of artificial intelligence applications.

On July 22, 2025, at Rebellions’ headquarters, a formal signing ceremony was held to underscore this collaboration. The event was marked by the presence of key executives from both organizations including CoAsia SEMI's CEO, DS Shin, and Rebellions' CEO, Sung Hyun Park, along with CoAsia Group Chairman Lee Hee-jun. The partnership follows an initial collaboration established in April, where both companies secured a national project dedicated to the development of a multi-petaflops Processing-In-Memory (PIM) server chiplet.

This latest agreement represents a deeper integration of resources and expertise, laying the groundwork for commercializing advanced products for the data center market. CoAsia SEMI's wealth of experience in 2.5D silicon interposer, alongside its advanced packaging solutions, will play a vital role in the project. Unlike traditional single System-on-Chip (SoC) models, the chiplet-based architecture enables superior flexibility in design, enhanced performance, and improved yield. These qualities are crucial for accommodating the increasing computational demands of AI tasks in high-performance computing (HPC) applications.

The collaborative development is expected to be finalized by the end of 2026, with large-scale manufacturing anticipated to commence subsequently. Both companies are committed to delivering substantial production volumes to both domestic and international AI data centers. Additionally, the partnership will engage with leading global players in outsourced semiconductor assembly and testing (OSAT), as well as intellectual property leaders, forming an expansive ecosystem intended to tackle the global AI semiconductor market.

To enhance the product offerings, CoAsia SEMI and Rebellions plan to jointly develop an advanced heterogeneous chiplet product that will build on the REBEL platform while incorporating high-bandwidth memory (HBM3E) and input/output dies. This initiative aims to broaden the REBEL product line and accommodate the rapidly evolving needs of the AI sector.

Park Sung Hyun, CEO and co-founder of Rebellions, remarked on the partnership, noting, "This collaboration illustrates our strategy to diversify our AI semiconductor lineup in response to the fast-evolving landscape of the AI market. The full-scale application of REBEL's chiplet architecture, coupled with CoAsia SEMI's advanced packaging capabilities, will drive the next wave of innovation in this domain."

DS Shin, CEO of CoAsia SEMI, echoed this sentiment, emphasizing the significance of the collaboration. He stated, "The strategic alliance between CoAsia SEMI and Rebellions combines our strengths in design, packaging, and software technologies. This will be pivotal in shaping the future of the AI semiconductor ecosystem. Following this agreement, we intend to enhance our development and production supply efforts with a top-tier AI client in the United States, securing our technological leadership in the rapidly expanding global AI semiconductor arena."

This collaboration between CoAsia SEMI and Rebellions sets the stage for transformative advancements in the semiconductor industry, paving the path for high-performance solutions tailored for the needs of tomorrow's AI-driven data infrastructures.