#USA #Fremont #Semiconductor #VertaCure #YES

Yield Engineering Systems Launches VertaCure XP G3

Yield Engineering Systems (YES), a renowned leader in semiconductor process equipment, proudly announces the introduction of its VertaCure XP G3 systems. These advanced units are specifically designed for applications in the advanced packaging sector of AI and High-Performance Computing (HPC).

Features of VertaCure XP G3

The VertaCure XP G3 system is a third-generation curing tool that operates at lower temperatures and is capable of managing multiple-layer RDL (Redistribution Layer) packaging for 2.5D and 3D integrated circuits. This product is an evolution in YES's product line, ensuring efficient thermal management with a remarkable uniformity of temperature within ±1 °C at temperatures exceeding 200 °C. This is critical for the curing of thick film polyimide (PI).

Operating through a fully automated six-zone vacuum system, the VertaCure XP G3 guarantees complete removal of residual solvents, thus establishing superior thermal stability essential for high-performance semiconductor applications.

Competitive Advantage

The system's unique control capabilities offer benefits that surpass traditional atmospheric curing methods, including improved particle performance and thermomechanical properties across a variety of polymers. Saket Chadda, Senior Vice President at YES, highlighted the importance of the VertaCure system's controlled environment, enabling remarkable durability and reliability required in semiconductor packaging technologies.

According to Alex Chow, Senior Vice President of Business Development and Marketing at YES, the VertaCure line not only enhances operational consistency but also establishes a cost-effective manufacturing process that solidifies YES's status as a market leader in advanced packaging solutions. The capabilities of the VertaCure XP G3 make it ideal for the rigorous demands of AI and HPC semiconductor applications, providing a scalable solution for high-volume manufacturing.

The YES Advantage

Based in Fremont, California, YES has a track record for providing cutting-edge technologies that cater to the evolving needs of the semiconductor sector. Their comprehensive range of tools includes packaging technology that embodies the company’s ethos of innovation and excellence. YES's target areas span memory systems, advanced AI applications, and biological sciences, emphasizing their role as a backbone in the development of next-generation solutions.

In conclusion, the launch of VertaCure XP G3 marks a pivotal moment in semiconductor manufacturing, setting new benchmarks for precision and excellence in the curing process. For more information about YES and its transformative solutions, visit YES.tech.