Active & Company's Scholarship Bank Earns Patent for New Loan Repayment System

Active & Company's Revolutionary Patent for Scholarship Loan Repayment

Active & Company, a company based in Chiyoda, Tokyo, recently announced that its scholarship repayment support service, "Scholarship Bank," has successfully acquired a patent. This new system innovatively redistributes surplus funds from donations and unutilized support payments to assist those involved in scholarship loan repayments.

Traditionally, companies solely funded scholarship repayments, but with Scholarship Bank, additional resources from donations can now supplement corporate contributions, paving the way for a more sustainable repayment solution. Through this mechanism, companies can deliver support more efficiently compared to acting individually, thereby alleviating the overall repayment burden on society.

Background and Challenges

In Japan, approximately half of university students rely on scholarships, many of which require repayments that can last up to 15 years. This repayment obligation places a significant financial strain on young people entering the workforce. While some companies have adopted proxy repayment systems to support their employees, limitations tied to individual corporate finances have hindered broader assistance.

Scholarship Bank's patent addresses this challenge by creating a system that not only utilizes corporate funding but also employs societal resources, such as donations, to foster a cycle of support for younger generations.

Overview of the Patent Technology

The patented technology allows surplus funds from donations, along with designated scholarship repayment funds (known as proxy repayment funds), to be pooled and managed. These funds are then redistributed automatically and fairly to eligible scholarship recipients who meet specific criteria. This robust approach to managing resources effectively stands to benefit many within the community.

Operational Process

1. Initiation of Support: Scholarship recipients secure employment with companies that participate in the proxy repayment program.
2. Repayment Aid: Through "Scholarship Bank," these individuals initiate their scholarship repayments.
3. Funds Acquisition: Donations and support funds are gathered while also managing unutilized repayment funds from retirement cases.
4. Redistribution: Based on factors such as duration of employment, eligible recipients receive redistributed funds, subsequently extending their repayment support duration.

Patent Information

- Patent Number: Patent No. 7720373
- Invention Title: Information Processing Device, Information Processing Method, and Program
- Filing Date: October 30, 2023
- Inventor: Junya Ohno

About Scholarship Bank and Active & Company

Scholarship Bank stands as Japan's first platform dedicated to supporting scholarship repayment, working towards reducing financial burdens to enable career changes, entrepreneurship, marriage, and more. By creating a conducive environment for proactive career development and sustainable employment cycles, the service aims to bring significant social change.

For more information, visit: Scholarship Bank