#USA #Advanced Packaging #Grapevine #ER Engineering #ECTC 2025

ER Engineering Unveils Cutting-Edge Advanced Packaging Solutions

ER Engineering Corp. is all set to make waves at the 75th IEEE Electronic Components and Technology Conference (ECTC) in Texas from May 27 to May 30, 2025. This event, held at the Gaylord Texan Resort & Convention Center, is a pivotal gathering for showcasing advancements in electronic components and technology.

Eager to engage with industry peers and customers, ER Engineering will exhibit its latest in advanced packaging solutions. This year's highlight includes a remarkable demonstration of high-precision laser drilling tailored for 2.5D/3D integrated circuits, which promises to revolutionize the standard of manufacturing in the semiconductor industry. Additionally, the company will introduce laser multi-beam applications and innovative plasma systems that deliver exceptional uniformity while maintaining superior thermal stability.

One of the star attractions will be ER’s comprehensive Flip Chip solution. This includes essential processes such as pre-bond adhesive application and plasma cleaning prior to filling. Furthermore, they will showcase state-of-the-art laser marking on containers/trays for enhanced traceability, ensuring high integrity during production processes.

Kevin Chang, the Marketing Director, alongside Leo Lee, Sales Supervisor, both bring extensive experience in the North American market and will be present at the conference to engage with partners and attendees. They will discuss the benefits and applications of ER's innovative technologies.

“Participating in ECTC is a significant opportunity for us to connect with industry experts and showcase how our advanced packaging technologies can shape the future of semiconductor manufacturing,” comments Chang.

ER Engineering will share booth space with its partner, Scientech, allowing for collaborative demonstrations and discussions. Attendees are encouraged to visit Booth 438, where they can explore firsthand how ER Engineering's advancements can contribute to the evolving landscape of semiconductor exploration.

Details of the event include:

• - Date: May 27-30, 2025
• - Location: Gaylord Texan Resort & Convention Center, 1501 Gaylord Trail, Grapevine, Texas, USA, 76051
• - Booth Number: 438

For more information about ER Engineering and their innovative solutions, you can visit their official website at ER Engineering. To view their latest promotional image, check this link.

As the industry moves towards greater innovation in semiconductor technology, ER Engineering stands at the forefront, ready to support and lead the development of advanced packaging solutions that are essential for future applications. Don't miss the chance to see their innovations in action and discuss opportunities for collaboration and growth during the conference.