Alloy Enterprises Launches Innovative Copper Cooling Solution for AI Data Centers

Alloy Enterprises Unveils Copper Direct Liquid Cooling



Alloy Enterprises has taken a defining step in the data center cooling sector with the launch of a new copper direct liquid cooling (DLC) solution. This innovative approach leverages the company's proprietary Stack Forging™ process, dramatically improving thermal performance and reducing energy consumption in AI data centers.

Meeting Rising Cooling Demands


As the demand for AI processing power continues to escalate, data center operators are facing unprecedented challenges in managing heat output. Traditional cooling methods struggle to keep pace with rising chip power densities, particularly as AI server racks now frequently exceed power densities of 120 kW. Recognizing this urgent need, Alloy Enterprises has developed a solution that not only meets but exceeds current cooling standards.

The Stack Forging process utilized by Alloy allows for significant advantages, including:
  • - A 10x reduction in pressure drop compared to traditional systems, which in turn allows for the use of smaller pumps, leading to further energy savings.
  • - A single-piece construction that eliminates common leak points found in current liquid cooling setups.

Revolutionizing Efficiency


Dr. Ali Forsyth, CEO and Co-founder of Alloy Enterprises, emphasizes the importance of these advancements, stating, "Alloy Enterprises is setting a new standard in direct liquid cooling technology with our proprietary Stack Forging process. We now deliver industry-leading thermal performance in both aluminum and copper."

With an optimistic outlook, the company notes that they are prepared to accommodate even greater demands, with projections indicating that rack densities could reach 600 kW in the near future. This transition to liquid cooling is now considered vital for data centers aiming to remain competitive in the fast-paced AI landscape.

Addressing Energy Consumption Concerns


The timing of this innovation is crucial. According to forecasts by McKinsey, global data center power demand could triple by 2030, and U.S. data centers may consume approximately 12% of the nation’s electricity. The urgent need for more efficient cooling solutions is underscored by recent data showing that rack densities have doubled in just two years due to the increasing intensity of AI workloads.

Alloy's DLC components stand out by offering thermal performance capable of meeting these growing demands. The reduction in pressure drop enables the use of 44 °C (111.2°F) water, making traditional refrigerated HVAC systems obsolete. This shift can lead to a remarkable 23% reduction in overall data center energy usage, a significant boon for both sustainability and profitability.

Financial Impact on AI Providers


For hyperscalers and colocation data center providers, these efficiency enhancements directly translate to increased revenue and lowered operating costs. Improved cooling capabilities enable more AI processing tasks to be completed at a reduced energy cost, allowing companies to optimize their output and reclaim space as compute density improves.

Moreover, Alloy's innovative thermal solutions facilitate better power usage effectiveness (PUE) and a decrease in total cost of ownership, which appeals to a market sensitive to economic pressures.

Sustainable Manufacturing Practices


Alloy Enterprises is committed to sustainability. The company's supply chain is entirely sustainable, recycling 100% of the aluminum and copper scrap generated during manufacturing—a practice that underscores the long-term environmental and monetary benefits of smart thermal design.

Early deployments of Alloy's copper DLC systems have shown promising results, hitting target thermal resistance benchmarks while maintaining outstanding pressure drop figures across demanding rack configurations.

Conclusion


As Alloy Enterprises begins shipping its copper DLC cold plates and thermal components, industry leaders are encouraged to explore these groundbreaking technologies. The white paper titled "The Future of Liquid Cooling: Novel Microchannel Architecture for Lower Pressure Drop Higher Thermal Performance" is available for those interested in understanding the fine details of this advancement further.

Explore Alloy Enterprises’ innovations in direct liquid cooling and consider how they might enhance the efficiency and sustainability of your AI data center operations.

Topics Consumer Technology)

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